Aug. 2023, 日本実験力学会学会賞（論文賞）（2023.8.30）, 放射線遮へいガラスの微小組成挙動に及ぼすレーザー照射の影響、実験力学、Vol. 22, No. 2, pp. 96-104., 日本実験力学会
涌井隆;山崎和彦;二川正敏

Apr. 2011, ＊ICEP2010ベストペーパー賞受賞（2011.4.13）, High-speed Laser Plating for Wire-Bonding Pad Formation, Transactions of The Japan Institute of Electronics Packaging, Vol. 3, No. 1, (2010) pp. 7-13, Japan Institute of Electronics Packaging (JIEP)
K. Maekawa;K. Yamasaki;T. Niizeki;M. Mita;Y. Matsuba;N. Terada;H. Saito

Material Properties Evaluation on Radiation Shielding Lead Glasses Irradiated by Pulsed Laser　　　　　　　　　　　　　　　
Takashi WAKUI; Kazuhiko YAMASAKI and Masatoshi FUTAKAWA
Advanced Experimental Mechanics, 23 Aug. 2022, [Reviewed]

Effect of Pulsed Laser Irradiation on the Micro-plastic Behavior of Radiation Shielding Lead Glasses　　　　　　　　　　　　　　　
涌井隆、山崎和彦、二川正敏, 日本実験力学会
Journal of JSEM (Journal of the Japanese Society for Experimental Mechanics), Jun. 2022, [Reviewed]

Nanosecond Laser-induced Coloration of Radiation Resistant Lead Glasses　　　　　　　　　　　　　　　
山崎和彦,加藤裕典,二川正敏,勅使河原誠, Lead, 日本実験力学会
Journal of JSEM (Journal of the Japanese Society for Experimental Mechanics), Dec. 2021, [Reviewed]

Thick Copper Wiring on Liquid Crystal Polymer Substrate by Nd:YVO4 Green Laser Irradiation　　　　　　　　　　　　　　　
Hisaya SONODA; Shota OHASHI; Mamoru MITA; Katsuhiro MAEKAWA and Kazuhiko YAMASAKI, Last
レーザ加工学会誌, Feb. 2020, [Reviewed]

On-Demand Laser-Sintering of Copper Micro-Particles on Ferrite/Epoxy Resin Substrates for Power Electronics Devices
Mitsugu Yamaguchi; Nobuyuki Miyagi; Mamoru Mita; Kazuhiko Yamasaki and Katsuhiro Maekawa, Thick copper wiring on ferrite/epoxy resin substrate was carried out by laser sintering of the paste prepared with 1 mu m-diameter copper micro-particles and organic solvents. A 532 nm-wavelength Nd:YVO4 green laser has a high adsorption both to the copper micro-particle paste and to the ferrite/epoxy resin substrate are used for laser ablation of the substrate and laser sintering.
From the microscopic observations and property evaluations of the laser-processed ferrite/epoxy resin substrate with copper, the following conclusions are obtained: (1) The paste prepared with 1 mu m-diameter copper and organic solvents made it possible a small-volume dispensing as well as a good laser sintering; (2) The use of 532 nm-wavelength Nd:YVO4 green laser has a high adsorption both to the copper micro-particle paste and to the ferrite/epoxy resin substrate, resulting in the formation of the laser-sintered film with 20 mu m in thickness and 15 mu Omega.cm in specific resistance. No damage to the substrate occurred; (3) The adhesion between the sintered film and the substrate is attributed to the removal of the surface epoxy layer by laser ablation. Copper micro particles penetrate to the exposed ferrite particles, being mechanically locked with each other at the interface; (4) The scratch test with a cotton swab and the peel test with an adhesion tape show that no separation took place at the interface., IEEE
Transactions of The Japan Institute of Electronics Packaging (Trans JIEP),(2016), 01 Dec. 2016, [Reviewed]

Burnability of Translucent Cobalt-oxide Glaze by Nd:YAG Laser Irradiation
山崎和彦、廣島有希也、前川克廣, Lead, レーザ加工学会
レーザ加工学会論文集, 01 Jun. 2016, [Reviewed]

On-Demand Gold Laser-Plating on Stainless Steel for Electrical Contacts
Mitsugu Yamaguchi; Nobuyuki Miyagi; Mamoru Mita; Kazuhiko Yamasaki; and Katsuhiro Maekawa, The present study discusses the formation of a conductive film from noble metal nanoparticles onto stainless steel substrate for electrical components, such as connectors, where conventional electroplating is not applicable. The proposed "laser plating" method consists in on-demand dispensing with nanoparticle paste followed by a short-time preheating and laser sintering. The aims are fourfold: to establish sintering technology for gold nanoparticles placed on an 18%Cr-8% Ni stainless steel substrate covered with a passivation film, to characterize the laser-sintered film, to discuss the laser sintering mechanism, and to examine applicability to industry. The major results obtained are as follows: the laser sintering formed a gold film with a diameter of 0.8 mm and a thickness of 0.3-1.0 mu m on the stainless steel substrate without any surface pretreatment; a laser with a wavelength of 915 nm enabled instantaneous sintering within one second in air; the laser-sintered gold nanoparticle film had such a high adhesion to the substrate that no separation occurred after 90 degrees-0.5R bend-peel tests; the high adhesion was attributed to interdiffusion of gold, iron, chromium and nickel in the course of sintering; a relatively high-preheat temperature around 523 K for 60 s produced a paste surface with a suitable absorbance of the infrared laser; a primary sintering of the preheated gold nanoparticles with a small amount of solvents, followed by an auxiliary sintering from the substrate side made possible an efficient sintering of the nanoparticles as well as high adhesion to the stainless steel substrate with a high thermal conductivity; the laser-sintered gold film possesses such a good electrical property., IEEE
Proceedings of International Conference on Electronics Packaging (ICEP) 2016, Sapporo, Japan, 20-22 April 2016, 20 Apr. 2016

On-demand Infrared Laser Sintering of Gold Nanoparticle Paste for Electrical Contacts
Mitsugu Yamaguchi; Shinji Araga; Mamoru Mita; Kazuhiko Yamasaki; and Katsuhiro Maekawa, This paper discusses the formation of a conductive film from noble metal nanoparticles as an alternative to conventional electroplating for electrical components, such as connectors, switches, and memory cards. The proposed method consists in dispensing with nanoparticle paste followed by laser sintering. The aims are fourfold: 1) to establish sintering technology for gold nanoparticles placed on a nickel-electroplated phosphor-bronze substrate; 2) to characterize the laser-sintered film; 3) to discuss the laser sintering mechanism; and 4) to examine applicability to industry. The major results obtained are as follows: the laser sintering formed a gold film with a diameter of 0.3-0.8 mm and a thickness of 0.3-0.5 mu m on the nickel-electroplated phosphor-bronze substrate; a laser with a wavelength of 915 nm enabled instantaneous sintering within 1 s in air; the laser-sintered gold nanoparticle film had such a high adhesion to the substrate that no separation occurred after 90 degrees -0.5R bend-peel tests; the high adhesion was attributed to interdiffusion of gold and nickel in the course of sintering; optical properties of the gold nanoparticle paste depend on preheat conditions. A relatively high-preheat temperature around 523 K for 60 s produced a paste surface with a suitable absorbance of the infrared laser; a primary sintering of the preheated gold nanoparticles with a small amount of solvents followed by an auxiliary sintering from the substrate side made possible an efficient sintering of the nanoparticles as well as high adhesion to the substrate with a high thermal conductivity; and the film possesses such a good electrical property as that of the electroplated one in reciprocating abrasion tests., IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY(TEMP), 14 Aug. 2015, [Reviewed]

Wear Resistance of Laser-Sintered Gold-Nickel Composite Film for Electrical Contacts
Mitsugu YAMAGUCHI; Shinji ARAGA; Mamoru MITA; Kazuhiko YAMASAKI; Katsuhiro MAEKAWA, Materials for electrical contacts not only require good electrical properties but must also satisfy requirements for wear resistance, low-friction coefficient, and corrosion resistance. To improve wear resistance, composite plating with dispersed nanoparticles on a metal matrix has been developed. The noble metal processes of dispensing gold nanoparticle paste with dispersed nickel nanoparticles on a phosphorbronze substrate followed by sintering with an infrared laser to form a laser-sintered gold-nickel composite film are described. Tests for adhesion, wear resistance, and electrical property of the laser-sintered film lead to the following conclusions: (1) an infrared laser enables the formation of a gold film containing dispersed nickel nanoparticles in an air atmosphere; (2) the laser-sintered film possesses an equally good adhesion to the substrate, wear resistance and electrical property as an electroplated one; (3) as nickel content increases, the distribution of nickel nanoparticles deposited on the gold composite film becomes uneven. The use of nickel nanoparticles with 0.5 mass% dispersion results in a relatively uniform distribution; (4) although contact resistance of the 0.5 mass% nickel-content film is slightly greater than that of a pure gold one, a low contact resistance of less than 100 m Omega is maintained, as shown by a reciprocated-sliding test consisting of 3000 repetitions; (5) the proposed on-demand method has considerable advantages as it takes just over 1 min to form a 0.3 mu m-thick film, and material consumption is reduced by a factor of ten in making a contact area with a diameter of 0.8 mm., IEEE
65th Electronic Components and Technology Conference (ECTC 2015), San Diego, CA, USA, May 26-29, 2015, poster session, 26 May 2015

Laser-based Conductive Film Forming with Gold Nanoparticles for Electrical Contacts
Mitsugu YAMAGUCHI; Shinji ARAGA; Mamoru MITA; Kazuhiko YAMASAKI; Katsuhiro MAEKAWA, The present study discusses the formation of a conductive film from noble metal nanoparticles as an alternative to conventional electroplating for electrical components, such as connectors, switches, and memory cards. The proposed method consists of inkjet printing with nanoparticle paste followed by laser sintering. The aims are fourfold: to establish sintering technology for gold nanoparticles placed on a nickel-electroplated-phosphor bronze substrate, to characterize the laser-sintered film, to discuss the laser sintering mechanism, and to examine applicability to industry. The major results obtained are as follows: the laser sintering formed a gold film with a diameter of 0.3-0.8 mm and a thickness of 0.3-0.5 mu m on the nickel-electroplated phosphor-bronze substrate; a laser with a wavelength of 915 nm enabled instantaneous sintering within one second in an atmosphere; the laser-sintered gold nanoparticle film had such a high adhesion to the substrate that no separation occurred after 90 degrees-0.5R bend-peel tests; the high adhesion was attributed to interdiffusion of gold and nickel in the course of sintering; optical properties of the gold nanoparticle paste depend on preheat conditions. A relatively high-preheat temperature around 523 K produced a paste surface with a suitable absorbance of the infrared laser; and a primary sintering of the preheated gold nanoparticles with a small amount of solvents, followed by an auxiliary sintering from the substrate side made possible an efficient sintering of the nanoparticles as well as high adhesion to the substrate with a high thermal conductivity., IEEE
64th Electronic Components and Technology Conference (ECTC 2014), Lake Buena Vista, Florida, USA, May 27-30, 2014, 27 May 2014

High-speed gold laser-plating on nickel-plated copper leadframe toward flip-chip packaging
T. Sagawa; M. Mita; K. Yamasaki; and K. Maekawa, High-speed laser plating (HLP) of gold nanoparticles on a nickel-electroplated copper leadframe has been developed. Dot patterns with a diameter of around 100 mu m are formed using an inkjet printer on the substrate, being locally heated with a near-infrared laser in air for a short-time irradiation of less than 1 s. The resulting HLP gold film with a thickness of about 0.3 mu m has a bulky structure as well as a high adhesion to the substrate. The successful bonding of gold wire with the gold pad can be utilized to form a stud bump, the height of which can be adjusted to around 60 mu m. A flip-chip LED package has been successfully fabricated by employing the present HLP-based method, but reliability tests still need to be done for practical application., IEEE
Proceedings of International Conference on Electronics Packaging (ICEP) 2014, Toyama, Japan, April 23-25, (2014), 23 Apr. 2014, [Reviewed]

Laser-sintered Porous Structures for Samarium-based Solid Oxide Fuel Cells
KAZUHIKO YAMASAKI; MASASHI KOIZUMI; KATSUHIRO MAEKAWA, Lead, An attempt has been made to fabricate both fuel and air electrodes for solid oxide fuel cells (SOFCs) by utilizing the green-tape laser sintering (GTLS) method. We prepared two types of green pastes with a mixture of samarium strontium cobaltite (SSC) powders for the cathode, NiO/SDC (sub-micrometer-sized samarium-doped ceria) cermet powders for the anode, polystyrene particles as sacrifice material, polymer binder and solvent. The mask printing method was formed an electrode film on the SDC substrate. The printed paste was dried at 433 K for 60 min in an electric furnace, before a pulsed Nd:YAG laser was irradiated in a row on the pattered sample. The GTLS parameters were set at 1.06 mu m in wavelength, 80 Hz in pulse frequency, 0.6-3.0 ms in pulse width, 0.1-0.5 mJ in pulse energy, about 0.4 mm in diameter of beam spot, and 3.3-16.7 mm/s in scan speed. A porosity of 22% in the SSC film has been attained although porous microstructures are influenced by pulse energy, pulse width, the defocus amount of laser beam, and substrate temperature during irradiation. The samarium-based electrode structure is less porous than conventional YSZ-based one. Adhesion between the electrolyte and the electrodes was insufficient. (C) 2014 Published by Elsevier Ltd., ELSEVIER SCIENCE BV
Proceedings of 8th International Conference on Porous Metals and Metallic Foams (Metfoam), NC, USA, June 23-26 (2013), 26 Jun. 2013

Laser-Assisted Patterning Using Metal Nanoparticle-Aggregate Powders　　　　　　　　　　　　　　　
Katsuhiro Maekawa; Kazuhiko Yamasaki and Mamoru Mita
Proceedings of The 2012 International Conference on Flexible and Printed Electronics (ICFPE), 06 Sep. 2012, [Reviewed]

エレクトロニクス実装用銀ナノ粒子ペーストのレーザ焼結特性　　　　　　　　　　　　　　　
山崎和彦; 前川克廣, Lead
レーザ加工学会論文集, 30 Jun. 2012, [Reviewed]

Drop-on-demand Laser Sintering with Silver Nanoparticles for Electronics Packaging
Katsuhiro Maekawa; Kazuhiko Yamasaki; Tomotake Niizeki; Mamoru Mita; Yorishige Matsuba; Nobuto Terada; Hiroshi Saito, This paper proposes a dry laser-sintering method and discusses characteristics of a laser-sintered silver thin film on a polyimide or a copper substrate. This novel technology consists of the following processes: first, ink-jet printing of metal nanoparticles with dispersants and solvents for minute patterning
second, short preheating to remove organic substances in the ink
and finally, millisecond-order laser-beam irradiation under atmospheric conditions with the flow of argon gas for metallization. Regarding the wiring, visible lasers with high absorption on the ink develop rapid metallization and activate solvent evaporation, resulting in a rough surface with large pores. Interface adhesion is increased by the anchoring effect in the course of laser irradiation. In contrast, near-infrared lasers with low absorption heat the ink from the polyimide interface, yielding a dense, low-specific-resistance structure. Regarding pad formation on the copper leadframe without any surface pre-treatments, interdiffusion takes place at the Ag/Cu interface and increases adhesivity. The structural quality of the laser-sintered silver pad is almost the same as that of an electroplated one, so that no difference in good wire-bondability is obtained when the near-infrared continuous-wave laser is irradiated for a short time of a millisecond order per lead. © 2011-2012 IEEE.
IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY(TEMP), 01 Jun. 2012, [Reviewed]

Laser sintering technology for printed electronics: Minute wiring and functional coating with Ag-nanoparticle paste
Katsuhiro Maekawa; Kazuhiko Yamasaki; Tomotake Niizeki; Mamoru Mita; Yorishige Matsuba; Nobuto Terada; Hiroshi Saito, An attempt has been made to develop laser sintering incorporated with ink-jet printing of metal nanoparticles. To attain a bulk-like functional-film structure with a Ag-nanoparticle (5 nm in average diameter) paste, we have clarified that preheating is necessary to reduce solvents in the paste before laser sintering, that sintering is to be started from the substrate using a continuous-wave, near-infrared laser beam with low-absorbance of the paste, and that atmospheric sintering without oxygen or argon atmosphere enables the nanoparticles to separate from the organic dispersant. Regarding minute wiring on a polyimide substrate, a high interface-adhesion induced by molecular-level mechanicallocking as well as a low specific resistance of 4.8 μ Ω · cm were obtained. In terms of wire-bond-pad formation on a Cu leadframe, a multistep printing process made it possible to form a 2-3 μm thick, φ 100 μm flat pad near the lead apex. Pull tests reveal that the wire bondability of the laser-sintered Ag pads is as good as that of electroplated ones.
Journal of Japan Institute of Electronics Packaging, Jan. 2012, [Reviewed]

The characteristics of laser welded magnesium alloy using silver nanoparticles as insert material
M. Ishak; K. Maekawa; K. Yamasaki, Last, This paper describes the characteristics of the laser welding of thin-sheet magnesium alloys using silver (Ag) nanoparticles as an insert material. The experiment was conducted using nanoparticles with 5 nm and 100 nm diameters that were welded with a Nd:YAG laser. The microstructure and mechanical properties of the specimens welded using inserts with different sizes of nanoparticles and without an insert material, were examined. Electron probe micro-analyzer (EPMA) analysis was conducted to confirm the existence of Ag in the welded area. The introduction of the Ag nanoparticle insert promoted large area of fine grain and broadened the acceptable range of scanning speed parameters compared to welds without an insert. Welds with 5 nm nanoparticles yielded the highest fracture load of up to 818 N while the lowest fracture load was found for weld specimens with 100 nm nanoparticles. This lower fracture load was due to larger voids and a smaller throat length, which contributed to a lower fracture load when using larger nanoparticles. (C) 2011 Elsevier B.V. All rights reserved., ELSEVIER SCIENCE SA
Materials Science and Engineering A, 2012, [Reviewed]

Temperature Soak Reliability of Laser-sintered Ag Pads for Wire Bonding
K. Yamasaki; K. Maekawa; T. Niizeki; M. Mita; Y. Matsuba; N. Terada; H. Saito, A small amount of Ag nanoparticles (5 nm in average diameter) was supplied to the tips of Cu lead-pins by ink-jet printing, and then metallized by laser irradiation to form circular wire-bonding pads between 2 and 3 μm thick and φ150 μm. A continuous-wave Nd:YAG laser (1064 nm in wavelength and 150 W in maximum power output) was employed in an argon atmosphere. A φ25 μm gold wire was bonded between the adjacent pads using an ultrasonic wire-bonder. The wire-bonded parts were placed in an atmospheric electric furnace for temperature soak tests in dry conditions at 150°C for up to 1000 h. Metallographic changes in the junctions were investigated by SEM, FIB, and EDX, while mechanical strength was examined by pull tests. No metallographic changes were observed in the 500 h specimen, whereas a slight solid-phase diffusion took place at both Cu/Ag and Ag/Au interfaces in the 1000 h specimen. The Ag pad formed on the Cu lead, above 2 μm in thickness, also prevented the degradation of pull strength
an average of 8.8 cN was maintained at both soak times. No separation from the first (ball) and second (wedge) bonds occurred, but the wire fractured close to the hook of the tester. © 2011 IEEE.
Proceedings of 13th Electronics Packaging Technology Conference (EPTC2011), 09 Dec. 2011, [Reviewed]

High-speed Laser Plating for Wire-Bonding Pad Formation
K.Maekawa; K. Yamasaki; T. Niizeki; M. Mita; Y. Matsuba; N. Terada; H. Saito, The present paper proposes high-speed laser plating for forming wire-bonding pads on a Cu leadframe using Ag nanoparticles. The novelty of the process lies in the implementation of drop-on-demand laser plating on the specially designed leadframe. Various aspects of the proposed method are investigated, including experimental set-up, multistep ink-jet printing, laser-plating parameters, quality of the sintered film, and wire bondability. It is found that both the quality of the sintered Ag pad and wire bondability are comparable to those of an electroplated Ag film when the near-infrared CW laser irradiates the pad for a short time of milliseconds. The superiority of the high-speed laser plating is confirmed from the viewpoints of material consumption, the necessity of pre- and post-processing, thermal damage to the pad and substrate, and environmental protection., The Japan Institute of Electronics Packaging
The Japan Institute of Electronics Packaging (JIEP), 24 Dec. 2010, [Reviewed]

FABRICATION OF ELECTRODE FILMS FOR SOLID OXIDE FUEL CELLS BY THE LASER SINTERING METHOD　　　　　　　　　　　　　　　
Kazuhiko YAMASAKI and Katsuhiro MAEKAWA, Lead
Proceedings of 2010 ISFA 2010 International Symposium on Flexible Automation, 12 Jul. 2010, [Reviewed]

High-Speed Laser Plating on Cu Leadframe Using Ag Nanoparticles
Katsuhiro Maekawa; Kazuhiko Yamasaki; Tomotake Niizeki; Mamoru Mita; Yorishige Matsuba; Nobuto Terada; and Hiroshi Saito, The present paper proposes high-speed laser plating for forming wire-bonding pads on a Cu leadframe using Ag nanoparticles. Various aspects of the proposed method have been investigated, including the shape and surface roughness of the lead, experimental set-up, multistep printing, laser-plating parameters, quality of the sintered film with FIB-SIM and LSM, and wire bondability between the Ag pad and an Au wire with a pull test. Experimental results with Ag nanoparticles were compared with those of furnace curing and electroplating. As a result, superiority of the laser plating process has been confirmed from the viewpoints of sintering time (millisecond order per lead), material consumption (picoliter order), the necessity of pre- and post-processing, wire bondability, thermal damage to the pad and substrate, and environmental protection. In particular, novelty lies in the implementation of drop-on-demand laser plating on the specially designed round lead., IEEE
60th Electronic Components and Technology Conference (ECTC 2010), 01 Jun. 2010, [Reviewed]

Size Effect of Ag Nanoparticles on Laser Sintering and Wire Bondability
Yoshiyuki Tsutsui; Kazuhiko Yamasaki; Katsuhiro Maekawa; Tomotake Niizeki; Ahmed Bucheeri; Mamoru Mita; Yorishige Matsuba; Nobuto Terada; and Hiroshi Saito, The present research aims to develop a dry process for forming wire-bonding pads on a Cu leadframe, where the dry process is defined as the use of the paste with metal nanoparticles and solvents and its laser sintering under air or argon atmosphere. In this report, the influence of Ag particle size on laser sintering and wire bondability is extensively investigated. Two types of Ag nanoparticles paste, phi 5 nm or phi 100 nm in average diameter, were coated on a Cu leadframe. Then, a focused near-infrared CW laser once scans the coated lead to make the paste metalized. Wire bondability between an Au wire and the Ag pad is examined by a pull test. Mechanisms of sintering as well as adhesion to the Cu substrate are discussed. Finally, these characteristics are compared with those of an Ag electroplated pad. As a result, the laser-sintered functional film using the phi 5-nm-particle paste yields a crystallized structure and wire bondability similar to those of electroplating, whereas a porous structure with lower wire bondability tends to be produced by the phi 100-nm-particle paste., IEEE
60th Electronic Components and Technology Conference (ECTC 2010), 01 Jun. 2010, [Reviewed]

Lap Fillet Laser Welding of AZ31B Thin Sheet Magnesium Alloy using Silver Nanoparticles
Mahadzir ISHAK; Kazuhiko YAMASAKI and Katsuhiro MAEKAWA, In this paper, the use of silver nanoparticles paste has been proposed to laser-weld AZ31B magnesium alloy with a thickness of 0.3 mm. The paste containing Ag nanoparticles of 5 nm in average diameter and an organic solvent was used to coat the surface of AZ31B thin sheet by a spin coater. The coated sheet was heated at 100 °C for 60 s to evaporate the solvent. The dried sheet was set as a lower AZ31B sheet on the jig, and then lap fillet welding was carried out by using a pulsed Nd:YAG laser in a closed box filled with argon gas. Characteristics of microstructure and mechanical properties of the joint were investigated. When the Ag nanoparticles paste was used, parameters for welding the thin AZ31B sheet were identified: a pulse energy of 1.8 J, pulse duration 3.0 ms, pulse repetition rate 80 Hz, and scan speed between 7.5 mm/s (450 mm/min) to 10.8 mm/s (650 mm/min). Under these conditions, the bond width improves, defects reduce and process parameters range broadens compared to welding without using the paste. Besides, the area of high hardness widens due to the increase of the fine grain area and the decrease of the heat affected zone. Weld joint efficiency also improves up to 92 % of the base metal., The Japan Society of Mechanical Engineers
J. Solid Mechanics and Materials Engineering, Jan. 2010, [Reviewed]

Laser Sintering of Silver Nanoparticles for Electronic Use
K. Maekawa; K. Yamasaki; T. Niizeki; M. Mita; Y. Matsuba; N. Terada; H. Saito, The silver NanoPaste (R) having silver nanoparticles with 5 nm in average diameter, coated either on a polyimide substrate or a copper one, is successfully sintered with CW lasers. A rapid metallization from the paste surface with the visible laser makes the evaporation of solvent and dispersant difficult, resulting in an insufficient sintering with large pores. In contrast, the near-infrared laser with a little absorption in the paste heats the substrate first, and then develops metallization up to the paste surface, so that an easy evaporation makes the structure denser No peeling was observed at the interface of the laser-sintered Ag film and the substrates. Its adhesive strength is nearly equal to that of the furnace-sintered sample., TRANS TECH PUBLICATIONS LTD
Materials Science Forum (2010), 23 Nov. 2009, [Reviewed]

Influence of Wavelength on Laser Sintering Characteristics of Ag Nanoparticles
K. Maekawa; K. Yamasaki; T. Niizeki; M. Mita; Y. Matsuba; N. Terada; H. Saito, The purpose of this study is to develop a dry process for minute wiring or interconnections without any wet process such as chemical etching and electroplating. The process is based on the use of metal nanoparticles and their metallization by laser sintering, which will bring a desktop manufacturing of electronic circuits in view. The present paper investigates the influence of wavelength on laser sintering characteristics of Ag nanoparticles, in which a CW Nd:YAG laser (1064 nm in wavelength), a CW laser diode (980 nm), a CW green laser (532 rim) and a CW Ar+ laser (488 nm) are employed. Sintering mechanism as well as adhesion to a polyimide substrate is extensively investigated by FIB observation and tensile-shear testing. As a result, the lasers with visible wavelength are preferable from the viewpoint of laser output and adhesion strength because of a high absorbance of light in the NanoPastee containing Ag nanoparticles, a dispersant and solvents. On the other hand, the near-infrared lasers yield a denser sintered structure, which leads to lower specific resistance, although it is a couple of times high compared to furnace curing., IEEE
The 59th Electronic Components and Technology Conference (ECTC 2009), May 2009, [Reviewed]

Packaging of Electronic Modules through Completely Dry Process
K. Maekawa; M. Mita; K. Yamasaki; T. Niizeki; Y. Matsuba; N. Terada; H. Saito, In order to establish technology of packaging electronic modules, we investigated conditions for laser sintering of Ag nanoparticles, and evaluated characteristics of the sintered film. First, we plotted minute patterns on a copper substrate by ink-jet printing, and then employed an Nd:YAG laser to metalize the nanopaste in a short time. The Ag nanoparticles (5 nm in average diameter) dispersed in organic solvents were solidified to form coarse agglomerates of about 0.05-0.5 mu m with a pulsed laser, or about 0.05 mu m by CW mode. We carried out a bend-peel test to find that no separation occurred at the interface between the sintered Ag film and the substrate. Adhesive strength of the laser-sintered pattern on the Cu substrate is higher or equal to than that obtained by furnace sintering. An SIM observation of FIBed cross-sections revealed that the laser-sintered film is as thin as less than 0.5 mu m, and has a porous structure. As for wiring a polyimide substrate, the use of water-repellant is indispensable for ink-jet printing. Three-step laser sintering enables us to make Ag wires on the polyimide film at a low laser power, which leads to less thermal damage to the substrate., IEEE
The 58th Electronic Components and Technology Conference (ECTC 2008), May 2008, [Reviewed]

Laser Sintering of Ag Nanopaste Film and Its Application to Bond-pad Formation
T. Niizeki; K. Maekawa; M. Mita; K. Yamasaki; Y. Matsuba; N. Terada; H. Saito, A novel coating technology by means of sintering the silver NanoPaste (R) by a laser beam has been proposed. The novelty lies in the use of a conventional Nd:YAG laser to metalize nanoparticles as an alternative to furnace sintering. Silver nanoparticles with 5 nm in average diameter dispersed in the the silver NanoPaste are successfully sintered on the Cu substrate by the proposed method. Laser sintering proceeds from the paste surface into the substrate, and the thickness of a peeling-free film is around 0.2 mu m. Multi-step sintering by the repletion of spin coating and laser metallization enables us to make a thicker Ag pad of around 1 mu m. No peeling of the laser-sintered Ag film from the substrate was observed. Its adhesive strength is higher than that of a furnace-sintered sample. The Ag film thus fabricated can be used as pads for wire bonding, being an alternative to electorplating., IEEE
The 58th Electronic Components and Technology Conference (ECTC 2008), May 2008, [Reviewed]

Fabrication of Functionally Porous Structures by the Sheet Lamination Method
K. Yamasaki; S. Fukuda; T. Murakami; and K. Maekawa, Lead, Recent trends in bio technology have resulted in the need for accurate fabrication of pore structure of sophisticated porous materials used in advanced applications such as substrates for tissue growth, and various kinds of implants. Control of pore size is important for promoting growth of blood vessels and adequate fluid flow. In the present study, an attempt has been made to fabricate functionally porous structures using titanium, including an internally controlled three-dimensional (3-D) fractal structure. A novel 3-D modeling method that combines rapid prototyping with spark plasma sintering (SPS) is proposed, which enables us to control the internal porous structure. Titanium powder-tape or sheet is sintered or cut by a pulsed Nd:YAG laser to form 2-D fractal cross-sections. These 2-D layers are temporarily laminated in a carbon mold, being then jointed by the SPS method to maintain the internal porous structure. Process parameters for the sheet lamination method have extensively been investigated., TRANS TECH PUBLICATIONS LTD
The 6th Pacific Rim International Conference on Advanced Materials and Processing (PRICM-6) Jeju Island, Korea, Nov. 2007, [Reviewed]

Ti-Based Ceramic Foams Processed by Sacrificial Template Method　　　　　　　　　　　　　　　
YULIYA ORLOVA; KAZUHIKO YAMASAKI; MIKHAIL SHTERN; KATSUHIRO MAEKAWA
5th International Conference on Porous Metals and Metallic Foams (MetFoam 2007), A60, Montreal, Canada, Sep. 2007

Fabrication of Gallium Nitride Gratings by Interferometric Irradiation Using Focused Femtosecond Laser
Kazuhiko Yamasaki; Takeshi Mizuno, Lead, We report the optical modification of gallium nitride by femtosecond laser irradiation. A 5-nm-band-gap shift, observed by spectral ellipsometry, results a reduction of 0.01 in the refractive index at a wavelength of 400 nm. An indistinct circular pattern was also observed using nano-beam diffraction. These results suggest that femtosecond-laser irradiation induces stress-strain, rather than slight amorphization. We also observed that the angle of first-order diffraction from the grating with a 1.0 mu m period, fabricated by interferometric irradiation using a fermosecond laser without any damage, corresponds to the calculated angle. The first-order diffraction efficiency for a wavelength of 403 nm was estimated to be 4.0 x 10(-3)%., INST PURE APPLIED PHYSICS
Jpn. J. Appl. Phys., Aug. 2006, [Reviewed]

Three-Dimensional Optical Recording in tert-Butoxycarbonyl-Protected Quinizarin Methacrylate Polymers
Takeshi Mizuno; Yoshihiko Tanamura; Kazuhiko Yamasaki; Hiroaki Misawa, We report photoacid-induced nonerasable recording in tert-butoxycarbonyl-protected quinizarin methacrylate polymers for three-dimensional optical memory. 1 m/s-speed recording was achieved using an 800nm femtosecond laser at an 80MHz-repetition rate, without a postexposure bake after laser irradiation. Three-layer recording indicates that no optical damage during recording enables modulation of the Compact Disc type memory. The linewidth of recorded marks of 0.4 mu m indicates a 49 Gbits/cm(2) areal density when the numerical aperture is 1.35., JAPAN SOC APPLIED PHYSICS
Jpn. J. Appl. Phys., Mar. 2006, [Reviewed]

Three-Dimensional Optical Memory in a Photoacid-Induced Recording Medium
Takeshi Mizuno; Kazuhiko Yamasaki; Hiroaki Misawa, We report a photoacid-induced write-once read-many recording medium based on poly(methyl methacrylate) for three dimensional (3D) optical memory, Three-layered recording was achieved using only an 800 nm-femtosecond oscillator with a 82-MHz-repetition rate without structural damage. Bits of arbitrary length used in the present modulation method of Compact Disc type memory can be recorded by photo-modification in the medium. The results suggest that the medium is an attractive candidate to solve the technical problems of 3D recording, in which micro-structural integrity of medium is altered., JAPAN SOC APPLIED PHYSICS
Jpn. J. Appl. Phys., Sep. 2005, [Reviewed]

セラミックスのレーザ焼結技術と固体酸化物形燃料電池への応用
山崎和彦; 前川克廣
セラミックス, 01 Feb. 2014, [Reviewed]
Lead

Laser Sintering of Ceramic Materials and Its Applications to Fabrication Technology for Solid Oxide Fuel Cells　　　　　　　　　　　　　　　
Kazuhiko Yamasaki; Katsuhiro Maekawa
2014

Bondability of Copper Wires onto a Laser-Sintered Silver Pad　　　　　　　　　　　　　　　
K. Yamasaki; S. Takahashi; M. Mita; K. Maekawa
Proceedings of International Conference on Electronics Packaging (ICEP) 2012, 19 Apr. 2012

プリンテッドエレクトロニクス用レーザ焼結技術：銀ナノ粒子ペーストを用いた微細配線及び機能性膜形成　　　　　　　　　　　　　　　
前川克廣; 山崎和彦; 新関智丈; 御田護; 松葉頼重; 寺田信人; 齊藤寛
エレクトロニクス実装学会誌, 01 Jan. 2012, [Reviewed]

茨城大学におけるプロジェクト型実習の実践とその効果　　　　　　　　　　　　　　　
山崎和彦; 王 東方; 前川克廣
工学教育（J.of JSEE）, 2012, [Reviewed]
Lead

High-speed Laser Plating for Wire-Bonding Pad Formation
K.Maekawa; K. Yamasaki; T. Niizeki; M. Mita; Y. Matsuba; N. Terada; H. Saito
Proceedings of International Conference on Electronics Packaging (ICEP) 2010, 12 May 2010, [Reviewed]

Microstructure and Corrosion Behavior of Laser Welded Magnesium Alloys with Silver Nanoparticles　　　　　　　　　　　　　　　
M. Ishak; K. Yamasaki; K. Maekawa
World Academy of Science, Engineering and Technology, 2010

Lap welding characteristics of thin sheet AZ31 magnesium alloy by pulsed Nd:YAG laser
Mahadzir ISHAK; Kazuhiko YAMASAKI and Katsuhiro MAEKAWA
Advances in Materials and Processing Technologies (AMPT) conference, 26 Oct. 2009, [Reviewed]

Ti FOAMS BY SOLID STATE REPLICATION　　　　　　　　　　　　　　　
Yu. Orlova; K. Yamasaki; K. Maekawa; H.J. Rack
6th International Conference on Porous Metals and Metallic Foams (MetFoam 2009), poster, 01 Sep. 2009, [Reviewed]

Fabrication of Functionally Porous Structures by the Sheet Lamination Method
K. Yamasaki; S. Fukuda; T. Murakami; and K. Maekawa
Materials Science Forum, Nov. 2007, [Reviewed]
Lead

Wiring Technology Using Silver NanoPaste by Means of Ink-jet Printing and Laser Sintering for Microfabrication
K. Maekawa; M. Mita; H. Saito; K. Yamasaki; Y. Matsuba; N. Terada; H. Saito
Proc. Asian Symposium on Materials and Processing (ASMP 2006), Sofitel Central Plaza Bangkok, Thailand, Nov. 9-10, Nov. 2006

Nd:YAG Laser, Ch.8 (Laser Welding of Thin Sheet Magnesium Alloys)　　　　　　　　　　　　　　　
Dan C. Dumitras (ed.); Mahadzir Ishak; Kazuhiko Yamasaki and Katsuhiro Maekawa, Joint work
InTech, Mar. 2012
9789535101055

Effect of laser processing on mechanical properties of beta-type titanium alloy　　　　　　　　　　　　　　　
畠山璃子; 小野寺貫太; 倉本繁; 山崎和彦
軽金属学会、第147回秋期大会, 09 Nov. 2024, 軽金属学会
20241108, 20241110

炭素繊維強化プラスチックとTi-6Al-4V合金のレーザ接合のための表層アブレーション加工技術　　　　　　　　　　　　　　　
岡野悠希; 山崎和彦
日本機械学会2024年度茨城講演会, 30 Aug. 2024, 日本機械学会関東支部茨城ブロック
20240830, 20240830

石英ガラス基板への銅粒子レーザ焼結膜形成における減圧加熱乾燥の効果　　　　　　　　　　　　　　　
窪田晃大; 山崎和彦
日本機械学会2024年度茨城講演会, 30 Aug. 2024, 日本機械学会関東支部茨城ブロック
20240830, 20240830

液晶高分子基板へのCu/NiOハイブリッドレーザ焼結膜の形成と評価　　　　　　　　　　　　　　　
アハマドワリージャ; 山崎和彦
日本機械学会2024年度茨城講演会, 30 Aug. 2024, 日本機械学会関東支部茨城ブロック
20240830, 20240830

溶体化処理したゴムメタルの金属組織と硬さに及ぼすレーザー照射の影響　　　　　　　　　　　　　　　
小野寺貫太; 畠山璃子; 山崎和彦; 倉本繁
日本機械学会2024年度茨城講演会, 30 Aug. 2024, 日本機械学会関東支部茨城ブロック
20240829, 20240830

銅マイクロ粒子レーザ焼結膜の高密度化に向けたレーザ予備加熱の影響　　　　　　　　　　　　　　　
押田拓也、山﨑和彦
2023年度精密工学会春季大会学術講演会, 16 Mar. 2023, 公益社団法人 精密工学会
20230314, 20230316

ミリ秒パルスレーザ照射による氷の局所相変化に関する微視的観察　　　　　　　　　　　　　　　
皆川真輝、山崎和彦、二川正敏
令和4年度日本機械学会関東支部茨城講演会, 19 Aug. 2022, 日本機械学会
20220819, 20220819

液晶高分子基板への銅マイクロ粒子レーザ焼結膜形成に関する研究　　　　　　　　　　　　　　　
寺﨑圭哉、山崎和彦
日本機械学会関東支部第28期総会・講演会, 15 Mar. 2022, 一般社団法人 日本機械学会関東支部
20220314, 20220315

CuO下地膜を用いた石英ガラス基板上へのレーザ焼結Cu膜形成技術　　　　　　　　　　　　　　　
西山大悟、山崎和彦
日本機械学会関東支部第28期総会・講演会, 15 Mar. 2022, 一般社団法人 日本機械学会関東支部
20220314, 20220315

2段階レーザ焼結法を用いた銅マイクロ粒子レーザ焼結膜の高密度化に関する研究　　　　　　　　　　　　　　　
押田拓也、寺﨑圭哉、山崎和彦
日本機械学会関東支部第28期総会・講演会, 15 Mar. 2022, 一般社団法人 日本機械学会関東支部
20220314, 20220315

アブレーションを施したチタン薄板とCFRPの直接レーザ接合　　　　　　　　　　　　　　　
鵜川柊平、山﨑和彦
日本機械学会関東支部第28期総会・講演会, 15 Mar. 2022, 一般社団法人 日本機械学会関東支部
20220314, 20220315

Materials Property Degradation of Radiation Shielding Lead Glasses by Laser irradiation　　　　　　　　　　　　　　　
Takashi WAKUI; Kazuhiko YAMASAKI; Makoto TESHIGAWARA and Masatoshi FUTAKAWA
16th International Symposium on Advanced Science and Technology in Experimental Mechanics, 3-6 November, 2021, Hanoi, Vietnam, 03 Nov. 2021
20211103, 20211106

レーザ焼結法による液晶高分子基板への銅厚膜形成　　　　　　　　　　　　　　　
山崎和彦
高周波対応基板の開発動向と樹脂/銅の密着性向上技術【Live配信セミナー】, 03 Dec. 2020, 株式会社 技術情報協会, [Invited]
20201203, 20201203

石英ガラス基板上への高密着性銅粒子レーザ焼結膜形成　　　　　　　　　　　　　　　
大橋翔太; 山崎和彦; 御田護; 前川克廣
第34回エレクトロニクス実装学会春季講演大会, 02 Mar. 2020, 一般社団法人 エレクトロニクス実装学会
20200303, 20200305

レーザ焼結法によるスーパーエンジニアリングプラスチックへの金属被膜形成技術の開発　　　　　　　　　　　　　　　
石川諒; 山崎和彦
第34回エレクトロニクス実装学会春季講演大会, 02 Mar. 2020, 一般社団法人 エレクトロニクス実装学会
20200303, 20200305

銅マイクロ粒子のレーザ焼結による絶縁基板への配線形成技術　　　　　　　　　　　　　　　
山崎和彦
茨城大学工学部附属教育研究センター第6回公開シンポジウム, 17 Dec. 2019, 茨城大学工学部

リングビームレーザによるりん青銅端子へのSn焼結膜形成技術　　　　　　　　　　　　　　　
齋藤 隆平,山崎 和彦
第90回レーザ加工学会講演, 10 Dec. 2018, レーザ加工学会

レーザ焼結法による固体酸化物形燃料電池用セリア系電解質薄膜形成　　　　　　　　　　　　　　　
石川 悠太,山崎 和彦
第90回レーザ加工学会講演, 10 Dec. 2018, レーザ加工学会

下地膜を利用した銅マイクロ粒子レーザ焼結法による石英ガラス基板への配線形成　　　　　　　　　　　　　　　
福島想人,山崎和彦,御田護,前川克廣
第88回レーザ加工学会講演, 12 Oct. 2017, レーザ加工学会

レーザ焼結法を用いたジルコニア系マイクロ固体酸化物形燃料電池用空気極膜の作製と評価　　　　　　　　　　　　　　　
吉田修一朗,山崎和彦,前川克廣
第88回レーザ加工学会講演, 12 Oct. 2017, レーザ加工学会

中間材を用いたアルミニウム薄板/CFRPのレーザ接合技術　　　　　　　　　　　　　　　
阿久津真広,山崎 和彦
第88回レーザ加工学会講演, 12 Oct. 2017, レーザ加工学会

難めっき金属材料への銀ナノ粒子レーザ焼結膜形成　　　　　　　　　　　　　　　
小野和秀,倉科 匡,御田 護,山﨑和彦,前川克廣
表面技術協会 第135回講演大会, 09 Mar. 2017

シリカコート金ナノ粒子を用いた石英光ファイバへのレーザ焼結金膜の形成　　　　　　　　　　　　　　　
長島将健,御田護,山崎和彦,前川克廣
第31回 エレクトロニクス実装学会春季講演大会, 06 Mar. 2017, エレクトロニクス実装学会

レーザ焼結技術の固体酸化物形燃料電池への応用　　　　　　　　　　　　　　　
山崎和彦,前川克廣
レーザー学会学術講演会第37回年次大会, 07 Jan. 2017, レーザー学会

高はんだ接合性金ナノ粒子レーザ焼結膜の形成　　　　　　　　　　　　　　　
赤荻怜,御田護,山崎和彦,前川克廣
第86回レーザ加工学会講演, 12 Dec. 2016, レーザ加工学会

レーザ焼結用銅マイクロ粒子トナーの開発とそのレーザ焼結特性　　　　　　　　　　　　　　　
理崎圭祐,御田護*,山崎和彦,前川克廣
第86回レーザ加工学会講演, 12 Dec. 2016, レーザ加工学会

フェライト/エポキシ樹脂基板への銅マイクロ粒子レーザ焼結法とパワーインダクタ製造技術への応用　　　　　　　　　　　　　　　
渥美良亮,御田護*,山崎和彦,前川克廣
第86回レーザ加工学会講演, 12 Dec. 2016, レーザ加工学会

Nd:YVO4グリーンレーザを用いた 熱硬化性樹脂基板への銅厚膜配線形成　　　　　　　　　　　　　　　
園田久也,足立修二,御田 護,山崎和彦,前川克廣
エレクトロニクス実装学会 秋季大会 第２６回マイクロエレクトロニクスシンポジウム（MES2016），2016/9/8-9, 1B2, (2016), 08 Sep. 2016, エレクトロニクス実装学会

マイクロ／ナノ粒子を用いたレーザ応用構造・機能創製　　　　　　　　　　　　　　　
前川克廣; 山崎和彦
第83回レーザ加工学会講演会，29-34, 11 Jun. 2015, レーザ加工学会

銅マイクロ粒子のレーザ焼結による膜厚7µm以上の導電膜形成　　　　　　　　　　　　　　　
足立修二; 前川克廣; 山崎和彦; 御田 護
第29回 エレクトロニクス実装学会春季講演大会, 18 Mar. 2015, エレクトロニクス実装学会

シリカコート金ナノ粒子のレーザ焼結技術　　　　　　　　　　　　　　　
山崎和彦; 小林佑基; 長島将健; 浅本麻紀子
平成２６年度推進研究プロジェクト成果報告会・特別講演会−次世代先進半導体加工・システム実装・高集積複合MEMS製造技術開発−, 06 Mar. 2015

レーザー焼結の最前線！！金属・セラミックス材料のレーザ焼結技術とその応用　　　　　　　　　　　　　　　
山崎和彦
第７０回：ＥＬＩＤ研削セミナー, 22 Dec. 2014

セリア系セラミックス材料のレーザ焼結における中間層導入の効果　　　　　　　　　　　　　　　
上野宗紀; 山崎和彦; 前川克廣
平成26年度日本機械学会関東支部茨城講演会, 05 Sep. 2014, 日本機械学会

セラミックス材料のレーザ焼結技術～固体酸化物形燃料電池への応用～　　　　　　　　　　　　　　　
山崎和彦; 前川克廣
日本セラミックス協会2013年年会サテライトプログラム 焼結の科学と技術, 17 Mar. 2014

レーザ焼結法によるセリア系電解質上へのSOFC用空気極膜の作製　　　　　　　　　　　　　　　
伊藤 匠; 山崎和彦; 前川克廣; 浅本麻紀子
平成25年度日本機械学会関東支部第20期総会・講演会, 15 Mar. 2014, 日本機械学会関東支部

金ナノ粒子レーザ焼結によるフリップチップ実装用パッド形成　　　　　　　　　　　　　　　
佐川貴久; 山崎和彦; 御田 護; 前川克廣
第28回 エレクトロニクス実装学会春季講演大会, 07 Mar. 2014, エレクトロニクス実装学会

パワーデバイス用銀ナノ粒子レーザ焼結膜の銅ワイヤボンディング性能の評価　　　　　　　　　　　　　　　
劉 夢清; 山崎和彦; 御田 護; 前川克廣
第28回 エレクトロニクス実装学会春季講演大会, 07 Mar. 2014, エレクトロニクス実装学会

金ナノ粒子レーザ焼結法による機能性膜の作製　　　　　　　　　　　　　　　
田川健太; 山崎和彦; 御田護; 前川克廣
第26回 エレクトロニクス実装学会春季講演大会，9D-08，pp.332-333, 09 Mar. 2012, エレクトロニクス実装学会

銀ナノ粒子ペーストレーザ焼結膜の銅ワイヤボンディング性　　　　　　　　　　　　　　　
高橋澄弘; 山崎和彦; 御田護; 前川克廣
第26回 エレクトロニクス実装学会春季講演大会，9D-07，pp.330-331, 09 Mar. 2012, エレクトロニクス実装学会

ワイヤボンディングパッド応用に向けた銀ナノ粒子レーザ焼結膜の形成　　　　　　　　　　　　　　　
山崎和彦
オープンセミナー「次世代先進半導体加工・システム実装・高集積複合MEMS技術開発」, 14 Dec. 2011

金属ナノ粒子のエレクトロニクス実装用レーザ焼結技術　　　　　　　　　　　　　　　
山崎和彦; 前川克廣
第76回レーザ加工学会講演会，143-148, 05 Dec. 2011, レーザ加工学会

レーザ焼結法によるマイクロSOFCセル用電極膜の作製　　　　　　　　　　　　　　　
小泉正志; 山崎和彦; 前川克廣
平成23年度日本機械学会関東支部茨城講演会, 26 Aug. 2011, 日本機械学会

短パルスレーザによる絶縁基板内部の3次元微細加工　　　　　　　　　　　　　　　
山崎和彦
平成23年度日本機械学会関東支部茨城講演会, 26 Aug. 2011, 日本機械学会

乾式レーザめっき法による微小金属機能性膜形成に関する研究　　　　　　　　　　　　　　　
高橋澄弘; 新関智丈; 山崎和彦; 前川克廣; 御田 護
平成22年度日本機械学会関東支部茨城講演会, 27 Aug. 2010, 日本機械学会

レーザ焼結法による固体酸化物形燃料電池用空気極膜の作製　　　　　　　　　　　　　　　
山崎和彦; 渡邉雅貴; 本橋嘉信; 前川克廣
第17回機械材料・材料加工技術講演会(2009.11), 07 Nov. 2009

ドライプロセスによる半導体パッケージ用ワイヤボンディング機能性膜形成　　　　　　　　　　　　　　　
筒井良行; 山崎和彦; 前川克廣; 御田護; 新関智丈
第17回機械材料・材料加工技術講演会(2009.11), 07 Nov. 2009

Nd:YAG laser lap fillet welding of thin sheet AZ31 magnesium alloy using silver nanopaste　　　　　　　　　　　　　　　
Mahadzir Ishak; 山崎和彦; 前川克廣
平成21年度日本機械学会関東支部茨城講演会, 25 Aug. 2009

Sintering parameters on fabrication of a micro-hole by powder metallurgy method　　　　　　　　　　　　　　　
アハメッドブチリ; 栗下裕明; 大曽根龍次; 直江崇; 加藤昌宏; 二川正敏; 前川克廣
平成21年度日本機械学会関東支部茨城講演会, 25 Aug. 2009

ピコ秒レーザ照射によるステンレス基板へのマイクロプリズム加工　　　　　　　　　　　　　　　
山崎和彦; 二川正敏; 前川克廣
日本機械学会関東支部第15期総会講演会, 15 Mar. 2009

Nd:YAGレーザによるAZ31マグネシウム合金薄板の重ねすみ肉溶接　　　　　　　　　　　　　　　
柴﨑有宏; 前川克廣; 山崎和彦; マハディール イシャク
日本機械学会関東学生会第48回学生員卒業研究発表講演会, 14 Mar. 2009

レーザ焼結法を用いた固体酸化物形燃料電池用多孔質電極膜の作製　　　　　　　　　　　　　　　
渡邉雅貴; 山崎和彦; 前川克廣
日本機械学会関東学生会第48回学生員卒業研究発表講演会, 14 Mar. 2009

Preparation of Ti Foams by Solid State Replication　　　　　　　　　　　　　　　
Yu. Orlova; K. Yamasaki; K. Maekawa and H.J. Rack
平成20年度超塑性工学研究センター研究成果報告会, 02 Mar. 2009

Fabrication of a micro-nozzle by using thermal mismatch in sintering of metal powders　　　　　　　　　　　　　　　
Ahmed BUCHEERI; Hiroaki KURISHITA; Ryuji OSONE; Takashi NAOE; Masahiro KATOH; Masatoshi FUTAKAWA; Katsuhiro MAEKAWA
平成20年度超塑性工学研究センター研究成果報告会, 02 Mar. 2009

絶縁基板上に塗布した銀ナノ粒子のレーザ焼結特性　　　　　　　　　　　　　　　
外薗貴之; 前川克廣; 山崎和彦; 御田 護
日本機械学会関東支部第15期総会講演会, Mar. 2009

ポリイミド基板上への銀ナノ粒子のレーザ焼結技術の開発　　　　　　　　　　　　　　　
筒井良行; 山崎和彦; 前川克廣
日本機械学会関東支部第15期総会講演会, Mar. 2009

Investigation of laser beam welding of AZ31B magnesium-based thin sheet　　　　　　　　　　　　　　　
Mahadzir Ishak; K. Yamasaki; K. Maekawa
Proceedings of the 4th International Student Conference at Ibaraki University, Nov. 2008

Lap fillet welding of thin sheet AZ31 magnesium alloy　　　　　　　　　　　　　　　
Mahadzir Ishak; 前川克廣; 山崎和彦
平成20年度日本機械学会関東支部茨城講演会, 12 Sep. 2008

Sintering of Multi-Component Mixtures during Manufacturing of Ti Foams　　　　　　　　　　　　　　　
Yuliya Orlova; 山崎和彦; 前川克廣; H.J. Rack
平成20年度日本機械学会関東支部茨城講演会, 12 Sep. 2008

粉末焼結法によるバブリングメゾノズルの開発　　　　　　　　　　　　　　　
大曽根龍次; Ahmed Bucheeri; 栗下裕明; 加藤昌宏; 直江崇; 二川正敏; 山崎和彦; 前川克廣
2008年度日本機械学会年次大会学術講演会, Aug. 2008

レーザ焼結法を用いた固体酸化物形燃料電池用多孔質電極膜の作製　　　　　　　　　　　　　　　
山崎和彦; 斉藤大介; 本橋嘉信; 前川克廣
2008年度日本機械学会年次大会学術講演会, Aug. 2008

シート積層法によるポーラス機能金属構造体の作製　　　　　　　　　　　　　　　
前川克廣; 堤 研介; 山崎和彦
2008年度日本機械学会年次大会学術講演会, Aug. 2008

金属ポーラス材の動的変形特性評価　　　　　　　　　　　　　　　
園部圭一; 前川克廣; 山崎和彦; 粉川広行; 二川正敏
日本機械学会関東支部第14期総会講演会, 15 Mar. 2008

シート積層法によるポーラス機能構造体の創製　　　　　　　　　　　　　　　
山崎和彦; 福田晴一; 村上 敬; 前川克廣
平成19年度超塑性工学研究センター研究成果報告会, 06 Mar. 2008

Structure formation during fabrication of Ti/Ti-based foams　　　　　　　　　　　　　　　
Y. Orlova; K. Yamasaki; K. Maekawa
平成19年度超塑性工学研究センター研究成果報告会, 06 Mar. 2008

Fabrication of Functionally Porous Structures by the Sheet Lamination Method　　　　　　　　　　　　　　　
K. Yamasaki; S. Fukuda; T. Murakami; and K. Maekawa
The 6th Pacific Rim International Conference on Advanced Materials and Processing (PRICM-6), 08 Nov. 2007

レーザ照射による釉薬の発色に関する研究　　　　　　　　　　　　　　　
山崎和彦; 渡辺孝俊; 内田修司; 前川克廣
第15回機械材料・材料加工技術講演会, Nov. 2007

Agナノペースト膜のレーザ焼結プロセスの解明　　　　　　　　　　　　　　　
齋藤弘宗; 前川克廣; 山崎和彦; 御田 護; 新関智丈; 松葉頼重; 齊藤 寛; 寺田信人
第15回機械材料・材料加工技術講演会, Nov. 2007

レーザ焼結法による多孔質固体酸化物形燃料電池電極の作製　　　　　　　　　　　　　　　
山崎和彦; 佐々木優介; 前川克廣; 本橋嘉信
2007年度日本機械学会年次大会学術講演会, Sep. 2007

水銀ターゲット用バブリングノズルの作製　　　　　　　　　　　　　　　
大曽根龍次; Ahmed Bucheeri; 栗下裕明; 二川正敏; 山崎和彦; 前川克廣; 加藤昌宏; 直江崇
2007年度日本機械学会年次大会学術講演会, Sep. 2007

バブリング用メゾノズル開発要素　　　　　　　　　　　　　　　
大曽根龍次; Ahmed Bucheeri; 栗下裕明; 加藤昌宏; 山崎和彦; 前川克廣; 直江 崇; 二川正敏
平成19年度日本機械学会関東支部茨城講演会, Sep. 2007

レーザ加工技術によるステンレス基板へのマイクロプリズムの作製　　　　　　　　　　　　　　　
田中翔太郎; 山崎和彦; 二川正敏; 前川克廣
平成19年度日本機械学会関東支部茨城講演会, Sep. 2007

銅基板上の銀ナノ粒子のレーザ焼結特製　　　　　　　　　　　　　　　
齋藤弘宗; 前川克廣; 山崎和彦; 御田 護; 松葉頼重; 齊藤 寛
平成18年度超塑性工学研究センター研究成果報告会, Mar. 2007

May 2023, 日本実験力学会

Dec. 2012, エレクトロニクス実装学会

Jan. 2012, レーザ加工学会

Jan. 2007, The Japan Society for Precision Engineering

Apr. 2006, The Japan Society of Mechanichal Engineering

Feb. 1997, The Japan Society of Applied Physics

ひたちテクノフェアin東京 2007　　　　　　　　　　　　　　　
前川克廣、他
Jul. 2007 - Nov. 2007, Others

ひたちテクノフェアin東京 2006　　　　　　　　　　　　　　　
前川克廣、他
Jul. 2006 - Dec. 2006, Others