Dec. 2020, ICPE2020 Best Paper Award, Development of 3D Topography Acquisition System for Abrasive Grains based on Deep Learning, 精密工学会 ICPE2020実行委員会
Hirotaka Ojima;Liu Yinglong;Libo Zhou;Jun Shimizu;Teppei Onuki
International society

振動援用切削でテクスチャ加工した圧痕状パターン周期配置型金属面の乾式すべり特性
清水 淳; 山本 武幸; 金子 和暉; 周 立波; 小貫 哲平; 尾嶌 裕隆, 砥粒加工学会
Abrasive technology : 砥粒加工学会誌 : journal of the Japan Society for Abrasive Technology, Apr. 2023

Abrasive wear damages observation in engineering ceramics using micro-Raman tomography
Teppei ONUKI; Kazuki KANEKO; Hirotaka OJIMA; Jun SHIMIZU and Libo ZHOU, JSME
Journal of Advanced Mechanical Design, Systems and Manufacturing, Bulletin of the JSME, 01 Jan. 2023, [Reviewed]

Anomaly detection system for manufacturing based on HHT+VGG16　　　　　　　　　　　　　　　
Toshihiro Komatsu; Shogo Ishikawa; Libo Zhou; Hirotaka Ojima; Kazuki Kaneko; Teppei Onuki; Jun Shimizu and Tomohiro Murakoshi, ICAT
The 24th International Symposium on Advances in Abrasive Technology (ISAAT2022), Dec. 2022, [Reviewed]

Study on Brittle-Ductile Transition in Grinding Process on Sapphire Wafer Using Micro-Raman Tomographic Imaging　　　　　　　　　　　　　　　
Teppei Onuki; Kazuki Kaneko; Hirotaka Ojima; Jun Shimizu; Libo Zhou, ICAT
The 24th International Symposium on Advances in Abrasive Technology (ISAAT2022), Dec. 2022, [Reviewed]

Study on Abrasive Wear Mechanism of C-plane Sapphire using Nanoscratch Test and Molecular Dynamics Simulation of HCP Crystal　　　　　　　　　　　　　　　
Jun Shimizu; Wangpiao Lin; Naohiko Yano; Kazuki Kaneko; Libo Zhou; Teppei Onuki; Hirotaka Ojima; Takeyuki Yamamoto and Kengo Saegusa, ICAT
The 24th International Symposium on Advances in Abrasive Technology (ISAAT2022), Dec. 2022, [Reviewed]

Molecular Dynamics Simulation of Chemical Mechanical Polishing of Si Wafer using Potential Control　　　　　　　　　　　　　　　
N. Hashimura; J. Shimizu; K. Kaneko; L. Zhou; T. Onuki; H. Ojima, 精密工学会
The 19th International Conference on Precision Engineering (ICPE 2022), Nov. 2022, [Reviewed]

Boundary Lubricity of Metal Surfaces Textured by Vibration-assisted Cutting　　　　　　　　　　　　　　　
J. Shimizu; K. Ohya; T. Yamamoto; L. Zhou; T. Onuki; H. Ojima; K. Kaneko; Y. Fukahori, 精密工学会
The 19th International Conference on Precision Engineering (ICPE 2022), Nov. 2022, [Reviewed]

Development of an anomaly prediction model using Monte Carlo dropout in LSTM　　　　　　　　　　　　　　　
K. Fukuda; T. Oshida; T. Murakoshi; L. Zhou; H. Ojima; K. Kaneko; T. Onuki; J. Shimizu, 精密工学会
The 19th International Conference on Precision Engineering (ICPE 2022), Nov. 2022, [Reviewed]

First-principles electronic structure calculation for analyzation of crystallographic damage states in Raman spectral data　　　　　　　　　　　　　　　
J. Kuroda; T. Onuki; K. Kaneko; H. Ojima; J. Shimizu; L. Zhou, 精密工学会
The 19th International Conference on Precision Engineering (ICPE 2022), Nov. 2022, [Reviewed]

Micro Raman Tomographic Imaging on Laser Beam Internal Damage into Sapphire for Laser Cleaving Process　　　　　　　　　　　　　　　
Teppei Onuki; Junnosuke Kuroda; Kazuki Kaneko; Hirotaka Ojima; Jun Shimizu; Libo Zhou
The 15th Pacific Rim Conference on Lasers and Electro-Optics (CLEO Pacific Rim (CLEO-PR 2022), Aug. 2022, [Reviewed]

Investigation of nanoscratch anisotropy of C-plane sapphire wafer using friction force microscope
Wangpiao Lin; Jun Shimizu; Libo Zhou; Teppei Onuki; Hirotaka Ojima
Precision Engineering, Jan. 2022, [Reviewed]

Binder-free Abrasive Pellet CMG砥石の開発と性能評価　　　　　　　　　　　　　　　
周立波; 野田雅人; 東瀬大知; 尾嶌裕隆; 小貫哲平; 清水淳; 山本武幸
砥粒加工学会誌, Dec. 2021, [Reviewed]

Study on Abrasive Grains Detection based on Deep Learning　　　　　　　　　　　　　　　
Takahiro Nishimura; Hirotaka Ojima; Zhou Libo; Teppei Onuki; Jun Shimizu
Proceedings of The 10th International Conference on Leading Edge Manufacturing in 21st Century (LEM21), Nov. 2021, [Reviewed]

Analysis of Nanoscratch Mechanism of C-Plane Sapphire with the Aid of Molecular Dynamics Simulation of Hcp Crystal
Wangpiao Lin; Naohiko Yano; Jun Shimizu; Libo Zhou; Teppei Onuki; Hirotaka Ojima
Nanomaterials, 01 Jul. 2021, [Reviewed]

Development of 3D Topography Acquisition System for Abrasive Grains based on Deep Learning　　　　　　　　　　　　　　　
Hirotaka Ojima; Liu Yinglong; Libo Zhou; Jun Shimizu; Teppei Onuki, Lead
Proceedings of The 18th International Conference on Precision Engineering, Nov. 2020, [Reviewed]

スロットライナ生産のための絶縁紙中空立体の切断特性の研究:―第1報 モータ用B字成形スロットライナの切断特性解析手法の開発―
小貫 哲平; 日下 祐太郎; 周 立波; 又平 浩; 中山 健一; 小野塚 英明; 松井 淳; 尾嶌 裕隆; 清水 淳,

The method of acquisition, analyzation and evaluation of cutting characteristics was developed on a hollow rectangular tube-like structure made of an electrical insulating paper (so called the slot liner in the motors of electric vehicles). The slot liner was cut by a steel disk blade. The cutting force was measured by the dynamometer, to evaluate the specific energy of the cutting: Cp, and the ratio of tangential and normal component of the force: μ, as the indicators of the cutting quality. Parameter estimations were applied using computer simulations of the slot liner in evaluating Cp and μ, with different cutting history (cutting length) of the blades. The difference of the cutting quality was found in variation of μ. Then filling up the hollows using the solid type jig and observations of by high-speed camera were helpful for eliminating the effect of the deformation.

, 公益社団法人 精密工学会
精密工学会誌, Oct. 2020, [Reviewed]

Friction characteristics of mechanically microtextured metal surface in dry sliding
Jun Shimizu; Tomotaka Nakayama; Kouta Watanabe; Takeyuki Yamamoto; Teppei Onuki; Hirotaka Ojima; Libo Zhou, Elsevier BV
Tribology International, Sep. 2020, [Reviewed]

Material removal mechanism in rotary in-feed grinding - Modeling and analysis -
Wentong LU; Libo ZHOU; Jun SHIMIZU; Teppei ONUKI; Hirotaka OJIMA; Takeyuki YAMAMOTO, The Japan Society of Mechanical Engineers
Journal of Advanced Mechanical Design, Systems, and Manufacturing, Sep. 2020, [Reviewed]

ロータリ型インフィード平面研削メカニズムに関する研究― 無線式動力計の開発と研削抵抗の評価 ―　　　　　　　　　　　　　　　
石橋 憲; 月井裕太; 蛯名雄太郎; 周 立波; 清水 淳; 山本武幸; 小貫哲平; 尾嶌裕隆, Corresponding
砥粒加工学会誌, Jan. 2019, [Reviewed]

実験とシミュレーションによる砥粒径のばらつきがウエハ研削面に与える影響の調査
蛯名雄太郎; 前崎智博; 周 立波; 清水 淳; 小貫哲平; 尾嶌裕隆; 乾 正知, Corresponding
精密工学会誌, Jul. 2018, [Reviewed]

The development of hybrid-feed system and technology of CFRP machining　　　　　　　　　　　　　　　
Daisuke Takenouchi; Hirotaka Ojima; Teppei Onuki; Jun Shimizu
Proceedings of The 9th International Conference on Leading Edge Manufacturing in 21st Century (LEM21), Nov. 2017, [Reviewed]

Development of Classification Method for Micro Particle by using Acoustic Standing Wave Field　　　　　　　　　　　　　　　
Hirotaka Ojima; Tomohiro Inada; Libo Zhou; Jun Shimizu; Teppei Onuki
Proceedings of The 7th International Conference of Asian Society for Precision Engineering and Nanotechnology (ASPEN), Nov. 2017, [Reviewed]

Study on the potential of chemo-mechanical-grinding (CMG) process of sapphire wafer
Ke Wu; Libo Zhou; Jun Shimizu; Teppei Onuki; Takeyuki Yamamoto; Hirotaka Ojima; Julong Yuan, Chemo-mechanical-grinding (CMG) is a hybrid process which integrates chemical reaction and mechanical grinding between abrasives and workpiece into one process. It has been successfully applied into manufacturing process of silicon wafers where both geometric accuracy and surface quality are required. This paper aims to study the potential of CMG process in manufacturing process of single crystal sapphire wafers. The basic material removal mechanism in terms of chemical effect and mechanical effect in CMG process has been analysed based on experiment results of two different kinds of CMG wheels. The experiment results suggest that chromium oxide (Cr2O3) performs better than silica (SiO2) in both material removal rate (MRR) and surface quality. It also reveals that, no matter under dry condition or wet condition, CMG is with potential to achieve excellent surface quality and impressive geometric accuracy of sapphire wafer. Meanwhile, test result by Raman spectrum shows that, by using Cr2O3 as abrasive, the sub-surface damage of sapphire wafer is hardly to be detected. Transmission electron microscopy (TEM) tells that the sub-surface damage, about less than 50 nm, might remain on the top surface if chemical effect is not sufficient enough to meet the balance with mechanical effect in CMG process., SPRINGER LONDON LTD
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, Jul. 2017, [Reviewed]

Theoretical analysis on effects of grain size variation　　　　　　　　　　　　　　　
Libo Zhou; Yutaro Ebina; Ke Wu; Jun Shimizu; Teppei Onuki; Hirotaka Ojima
Precision Engineering, Apr. 2017, [Reviewed]

ナノ接触実験結果と酸化膜の影響を考慮したすべり摩擦の分子動力学シミュレーション　　　　　　　　　　　　　　　
清水 淳; 周 立波; 小貫哲平; 尾嶌裕隆; 三輪紘敬; 南部俊和
トライボロジスト, Dec. 2016, [Reviewed]

Development of separation method for industrial waste by using acoustic standing wave field
Tomohiro INADA; Libo ZHOU; Hirotaka OJIMA; Jun SHIMIZU,

In recent years, more than 10 million tons of industrial wastes are discarded annually. Those wastes are mainly composed of plastic, glass and metals which are the materials massively used in automobiles, electric and electronic products. It is well known that industrial waste contain precious metals like gold and have a great value of reutilization. Therefore, technology to properly separate the waste by their types of subject is very important for recycling industry. In this study, we have developed a new separation method by use of acoustic levitation phenomenon in a standing wave field. Unlike the conventional methods such as centrifugal particle separation or magnetic separation, this method enables to sort subjects by their densities, without relying on other material properties including size, magnetism and weight. First described in this paper is a theoretical analysis of levitation force exerted on an object to derive its trajectory in a standing wave field. It is found that the motion of the object is governed by its density and the strength of acoustic field. Based on this finding, we developed a prototype of separation system with twin-transducers and a belt conveyer. As a result of test to separate a mixture of SiO₂ and Fe particles, 62wt% SiO₂ is captured at node side while 72wt% Fe is captured at anti-node side. Finally, the prototype is used to repeatedly separate the chipped waste of actual OA equipment. Its density was increased about 150%.

, 日本機械学会
日本機械学会論文集 C編, 25 Sep. 2016, [Reviewed]

Research on Development of On-Machine 3D Measuring System of Grinding Wheel Surface Topography by Stereo Images
Hirotaka OJIMA; Takuya NAGAYAMA; Libo ZHOU; Jun SHIMIZU and Teppei ONUKI, The shape and distribution of abrasive grains in the grinding wheel have a significant influence on the grinding performance. Therefore in order to realize the high-precision grinding process, it is essential to measure the shape and distribution of abrasives on wheel working surface. We have developed an on-machine 3D measurement system to study the surface topography of grinding wheel by binocular stereopsis without demounting the wheel from the grinding machine. In comparison to the results measured by the laser microscope, the developed system has been confirmed to have the accuracy of -5.6% in the horizontal direction and -3.4% in the vertical direction. Also, we analyzed the behavior and variation of individual grains by tracking observation of 3D topography of the grinding wheel working surface in the grinding process by using this system. As the result, the distribution and variation of abrasive grains including protrusion height, flat part length, half-tip angle, grain density and effective cutting edge density are able to be quantitatively evaluated., 精密工学会
精密工学会誌, Feb. 2016, [Reviewed]

Molecular Dynamics Simulation of a Cutting Method by Making Use of Localized Hydrostatic Pressure
Jun Shimizu; Keito Uezaki; Libo Zhou; Takeyuki Yamamoto; Teppei Onuki; Hirotaka Ojima
Advanced Materials Research, Jan. 2016, [Reviewed]

Study on Sapphire Wafer Grinding by Chromium Oxide (Cr2O3) Wheel
Ke Wu; Naoki Yamazaki; Yutaro Ebina; Libo Zhou; Jun Shimizu; Teppei Onuki; Hirotaka Ojima; Takashi Fujiwara
Advanced Materials Research, Jan. 2016, [Reviewed]

Wide range and accurate measurement of wafer thickness gauge using optical spectral analyzer
Teppei Onuki; Yutaro Ebina; Hirotaka Ojima; Jun Shimizu; Libo Zhou
Advanced Materials Research, Jan. 2016, [Reviewed]

Process study on large-size silicon wafer grinding by using a small-diameter wheel
Yutaro Ebina; Tomoya Yoshimatsu; Libo Zhou; Jun Shimizu; Teppei Onuki; Hirotaka Ojima, Silicon (Si) is a fundamental material in the semiconductor industry. The advancement of semiconductor devices have offered convenience and comfort to our life. In order to raise productivity and economic efficiency, the semiconductor industry keeps looking for use of larger size Si wafers. The next generation wafer is expected to be sized as large as 450 mm in diameter. Many wafering processes including lapping, grinding and polishing have been studied and grinding technology stands out as the most promising process for large-size Si wafer manufacturing. In the current in-feed grinding scheme adopted for Si wafers, the wheel diameter used is generally equal to or larger than the wafer diameter. In turn, larger diameter wheels require larger size machine tools and production lines, which lead to increase in manufacturing costs. In this paper, both experiment and kinematical analysis have been carried out to investigate the feasibility of using small diameter grinding wheels to grind large size Si wafers, mainly focusing on the effects of wheel diameter on wafer geometry and surface roughness. The results show that both wheels generated a central convex profile on the wafer and the small wheel achieved a slightly better flatness than the large wheel. The surface roughness were similar one to another for most area of the wafer except the fringe around its edge. All these experimental results were predicable by the kinematic model established in this paper. Particularly, the kinematic analysis found that the cutting path made by small wheel with diameter equaling to the wafer radius was parallel each other at the fringe around wafer edge, which directly worsened the surface roughness., JAPAN SOC MECHANICAL ENGINEERS
JOURNAL OF ADVANCED MECHANICAL DESIGN SYSTEMS AND MANUFACTURING, 2015, [Reviewed]

Modeling of process mechanisms in pulsed laser micro machining on lithium niobate substrates
TeppeiOnuki; Ippei Murayama; Takahiro Ojima; Jun Shimizu; Libo Zhou, The mechanism behind the laser ablation of LN is investigated using near infrared pico-second-pulsed laser. A model of the mechanism is developed, deriving the mechanical, thermal, and photonic properties of LN in addition to doing preliminary experiments on laser ablation with controlled laser fluence. β is material removal using the nonthermal process via multiphoton ionization, γ is nonthermal material removal with chipping or cracking produced by generated heat (but at temperatures below the melting point), and δ is material removal using the thermal process with temperatures above the melting point, resulting in resolidification at the surface and the adhesion of oncemolten burrs around the processed area. In a process modes map constructed through exhaustive experiments on laser ablation under various irradiation conditions (at specific energy ρ and with number of pulse shots N′), different contributions of ρ and N′ in the machining process are found. In terms of machining quality, desirable conditions in the control of laser irradiations are the use of weaker ρ and increased N′ to keep thermal damage to a minimum and to raise the removal rate., Fuji Technology Press
International Journal of Automation Technology, Nov. 2014, [Reviewed]

近赤外分光器を用いた反射分光方式の薄シリコンウェハ厚さ計　　　　　　　　　　　　　　　
小貫哲平; 小野竜典; 尾嶌裕隆; 清水淳; 周立波
砥粒加工学会誌, Aug. 2014, [Reviewed]

Development of Areal Wavelet Transform for the 2D images　　　　　　　　　　　　　　　
Hirotaka Ojima; Libo Zhou; Jun Shimizu; Teppei Onuki; Taiju Suzuki
Proceedings of 15th International conference on Precision Engineering (ICPE2014), Jul. 2014, [Reviewed]

Comparative Investigations of Analysis Methods in Thickness Inspections of Ultra Thin Semiconductor Wafers by Means of White Light Reflectmetry　　　　　　　　　　　　　　　
Teppei Onuki; Hirotaka Ojima; Jun Shimizu; Libo Zhou
Proceedings of 15th International conference on Precision Engineering (ICPE2014), Jul. 2014, [Reviewed]

Influence of surface integrity in silicon wafer thickness measurements by reflection spectroscopy
Teppei Onuki; Ryusuke Ono; Hirotaka Ojima; Jun Shimizu and Libo Zhou, Wafer thickness meter by reflection spectroscopy is used for on-site thickness inspections in wafer thinning process, because of its excellent properties as high measurement accuracy in very thin wafers inspections by non-contact sensing. In practice, ground surfaces are not ideal flat surfaces. Thus the spectra suffers influences of the surface roughness and the waviness, as modifying spectral features by optical diffusion, and as decreasing the reflection received by dispersion of propagating directivity. In this paper, we investigate how the surface integrities of ground wafer surfaces are involved in the thickness measurements by both theoretical and experimental approach, to investigate the requirements in sample conditions and to guarantee the accuracy of the measurements., Trans Tech Publications Ltd
Advanced Materials Research, Jun. 2014, [Reviewed]

Wafer Grinding Using Fixed Abrasive Diamond Wheel – Evaluation of cutting edge distribution in Diamond Wheels –
Yutaro. Ebina; Libo Zhou; Jun Shimizu; Teppei Onuki; Hirotaka. Ojima, The wafer grinding by use of fixed abrasive diamond wheels is required to create a high-quality wafer surface in a short time. In general, it is known that the grinding performance of diamond wheel is mainly dependent on grinding wheel specifications and grinding conditions. The cutting edge distribution or abrasive protrusion height in depth-wise of a specified wheel is one of the most important factors to determine the finishing surface roughness and the grinding force, which in turn determine the surface and subsurface quality of ground wafers. The overall purpose of this study is to understand the dynamic behavior of each diamond abrasive via modeling an actual diamond wheel and simulating of wafer grinding. In previous report [1], we have theoretically analyzed three-dimensional cutting edge distribution on the working surface of diamond wheels. This paper reports our recent achievements in the evaluation of 3-D cutting edge distribution in depth-wise of a specified wheel via the bearing ratio of its topography., Trans Tech Publications Ltd
Advanced Materials Research, Jun. 2014, [Reviewed]

Development of non-contact classifying systems by use of acoustic levitation
Tomohiro Inada; Libo Zhou; Jun Shimizu; Hirotaka Ojima; Takuya Ito, The phenomenon that bubbles or particles are suspended at the node position of a standing wave of sound is known as acoustic levitation and has recently been applied in the fields of semiconductors, aerospace, and biology [1-3]. By using this phenomenon in this study, a new classification method has been proposed, and a device has been developed to sort objects in accordance with their densities. Unlike the conventional methods as such as centrifugal particle separation or magnetic separation, this method can separate fine particles both of metal and non-metal and without contact easily only using acoustic power. First, we derived the acoustic radiation pressure to be applied to the object from King’s theory, and then we designed and developed a twin-transducer system to apply the required levitation force. The distributions of sound pressure and particle velocity were then visualized. Finally, a series of experiments was conducted to show the capability of classifying the fine abrasive SiO2 particles and fine iron particles (f = 50 μm)., Trans Tech Publications Ltd
Advanced Materials Research, Jun. 2014, [Reviewed]

Development of Microtextured Photocatalytic Surface by Vibration-assisted Scratching　　　　　　　　　　　　　　　
Jun Shimizu; Takeyuki Yamamoto; Libo Zhou; Teppei Onuki; Hirotaka Ojima
Materials Science Forum, May 2014, [Reviewed]

A Thin Silicon Wafer Thickness Measurement System by Optical Reflectmetry Scheme Using Fourier Transform Near-Infrared Spectrometer
Teppei Onuki; Ryusuke Ono; Akira Suzuki; Hirotaka Ojima; Jun Shimizu; Libo Zhou, In this study, measurable thickness range was improved by re-customized components of the thickness measurement system using the method of Fabry-Perot interference signature analyzing. A Fourier transform near infrared (FT-NIR) spectrometer with indium gallium arsenide was used in the developed system. As a result of the sensitiveness in the whole near infrared band and high spectral resolution united with high signal noise ratio of the FT-NIR spectrometer, the maximum measurable thickness is improved to 88 mu m while sub-micron order of the minimum measurable thickness is also improved., TRANS TECH PUBLICATIONS LTD
Advanced Materials Research, Sep. 2013, [Reviewed]

Fabrication of Surface Microtexture by Vibration Assisted Cutting
Jun Shimizu; Takeyuki Yamamoto; Libo Zhou; Hirotaka Ojima; Teppei Onuki; Shun-ichi Nagaoka, Improving materials surface function by introducing nano/micro surface textures is of great interest in various fields. The authors have also achieved an improvement in the photocatalytic surface function by introducing the microcutting grooves texture on the titanium dioxide surfaces. In this report, the authors performed the vibration assisted cutting to fabricate finer surface microtextures anticipating future usage as microtexture moulds for the nanoimprinting and/or injection moulding. In the experiment, a pure copper plate was cut using a sharply pointed triangular diamond tip vibrated by a fast tool servo system in the direction of cutting depth with pm order amplitude and kHz order frequency. As a result, it was found that the periodical micro concave-convex patterns with the combinations of impressions and pileups can be obtained by the proposed method using almost the same vibration amplitude as the cutting depth. It was also achieved that a micro-textured surface with numerous concave-convex patterns less than 1 pan in height with 3 pm in pitch., TRANS TECH PUBLICATIONS LTD
Advanced Materials Research, Sep. 2013, [Reviewed]

大口径Siウエハ表面形状の計測評価技術に関する研究―第2報：ウェーブレット変換を用いたノイズ除去手法の適用―　　　　　　　　　　　　　　　
尾嶌裕隆; 周 立波; 清水 淳
精密工学会誌, Jul. 2013, [Reviewed]

Development of Finishing System Using Acoustically Levitated Abrasive
Tomohiro Inada; Libo Zhou; Hirotaka Ojima; Jun Shimizu, Based on the acoustic levitation phenomenon, we propose and develop an acoustic levitation / positioning system to control the movements of free abrasives to finish inner surfaces. Described in this paper are the theoretical analysis of levitation forces generated in a standing wave field and the results of experiments involving levitation and positioning. We first calculate the wave amplitude and frequency required to levitate the abrasives. Based on the results, we develop a system consisting of a sound transducer (speaker), a reflector (an aluminum plate), an amplifier, and a function generator, and we successfully not only levitate but also position actual abrasives in a tube. We find that the relation between the size and density of the abrasives and the strength of the acoustic field (wave amplitude and frequency) basically agree with the theoretical prediction. In addition, the kinetics of levitated abrasives, including their positions and movements, are precisely controlled by varying the wave frequency and switching from one node position to another., Fuji Technology Press
International Journal of Automation Technology, 2013, [Reviewed]

Study on grinding processing of sapphire wafer
Yutaro Ebina; Libo Zhou; Jun Shimizu; Teppei Onuki; Hirotaka Ojima; Yoshiaki Tashiro, This paper reports our recent results on the diamond grinding process of single crystallized sapphire wafers. It was found that the diamond grains were severely dislodged at the wheel/workpiece interface and the material was removed by a mixed process of both grinding and lapping. Grinding governed the wafer center while lapping dominated its fringe. By increasing the wheel speed, it was able to shift the dominant process from lapping to grinding, and achieve a better surface roughness. Nine diamond wheels varying in both concentration and bond material were tested in surface grinding of 6 inch sapphire wafer, to investigate the dynamic behavior of diamond grain in the grinding process and its resultant surface quality and productivity., TRANS TECH PUBLICATIONS LTD
Advanced Material Research, 2012, [Reviewed]

Research on digital filters for Si wafer surface profile measurement –Design of filters by total variation
Hirotaka Ojima; Kazutaka Nonomura; Libo Zhou; Jun Shimizu; Teppei Onuki, The underlying data form of a wafer is a matrix of length (or height) measurements. In the presence of noise, evaluation parameters are normally biased. The expectation value such as peak-to-valley and GBIR (global backside ideal range) is systematically larger than the "true" value. Correction and compensation need a large population of measurements to analytically estimate both bias and the uncertainty. In this study, approach to obtain the true value is to extract a "true" profile by filtering noise from the measured data. In previous paper, the digital filter with wavelet transformation (WT) is proposed and efficiency to remove the noise, however, the method is introduced the pseudo-Gibbs effect. Then, we propose the digital filter with new algorithm of total variation (TV). In this paper, the new algorithm of TV is proposed and the digital filter by new TV indicate that data is filtered without the pseudo-Gibbs effect. The digital filters by WT and new TV are applied on the sample data of actual measurement system to investigate their performance of noise reduction., TRANS TECH PUBLICATIONS LTD
Advanced Materials Research, 2012, [Reviewed]

Molecular Dynamics Simulation of Metal Cutting with Local Hydrostatic Pressure Field Formation
Keito Uezaki; Jun Shimizu; Libo Zhou; Teppei Onuki; Hirotaka Ojima, Improving machined surface integrity is one of the important issues in the precision machining. This study aims to develop a cutting tool, which enables to generate a local hydrostatic pressure field in the vicinity of the cutting point to suppress the extra plastic flow in the workpiece, because it is known that materials including metals never cause plastic flow and fracture no matter how much greater hydrostatic pressure field is given. In this paper, a simple cutting tool with planer jig is proposed and a molecular dynamics simulation of cutting is performed as the first step. As a result, it is confirmed that the reduction of the plastic deformation, mainly in the burr formation become remarkable with the proposed model due to the suppression of extra side plastic flow, and relatively high-hydrostatic stress field is formed in the vicinity of cutting point. However, it is also observed that relatively many dislocations are generated beneath the cutting groove., TRANSACTION PUBLISHERS
Key Engineering Materials, 2012, [Reviewed]

Study on Surface Profile Evaluation for Large Si Wafer Measurement -1st Report : Denoising by Use of Wavelet Transform-
Libo ZHOU; Masashi ONO; Hirotaka OJIMA; Jun SHIMIZU, In recent semiconductor industry, production and evaluation of ever flatter, thinner and larger Si wafer are required to fulfill the demands in high integration and cost reduction. However, uncertainty in measurement of wafer profile is encountered as a severe problem because the resolution required for analysis of wafer flatness is reaching the limits of available instrument. Thus, the measured profile data always incorporate a certain degree of noise and this noise component behaves to bias the outputs of wafer profile such as SFQR (Site Frontsite least-sQuares focal plane site Range), GBIR (Global Backside Ideal Range), bow, warp and etc.. In order to precisely evaluate the wafer geometry, it is essential to remove the noise from the measured data. Described in this paper is design and development of digital filters for denoising by use of wavelet transform. Compared to the conventional low-pass filters, the developed filter not only provides better performance of decomposition in the spatial frequency domain, but also offers the new capability of filtering in amplitude components., The Japan Society for Precision Engineering
精密工学会誌, Dec. 2011, [Reviewed]

近赤外分光計測を用いた薄片シリコンウエハの厚さ計測法　　　　　　　　　　　　　　　
小貫哲平; 小野竜典; 尾嶌隆裕; 清水淳; 周立波
砥粒加工学会誌, Dec. 2011, [Reviewed]

Siウエハ仕上げ加工に及ぼす加工変質層の影響の解析－ナノスクラッチ実験と分子動力学シミュレーションによる検討－　　　　　　　　　　　　　　　
清水 淳; 周 立波; 小貫哲平; 尾嶌裕隆; 山本武幸; 鈴木直紀
砥粒加工学会誌, Nov. 2011, [Reviewed]

Spectroscopic measurements of silicon wafer thickness for backgrinding process
Teppei Onuki; Naoto Takagi; Jun Shimizu; Hirotaka Ojima; Libo Zhou, The optical microgauge system by means of near-infrared spectroscopic measurements was proposed as the thickness monitoring tool in the silicon wafer thinning process. The Fabry-Pelot interferometry and Beer's law were employed as the principles of the system for extracting the wafer thickness from optical spectroscopic system prototyped in this study. The specifications of the system such as the thickness range and resolution were examined on the prototyped system. The filed test verified the developed system available of monitoring Si wafer as thin as 5 mu m., TRANS TECH PUBLICATIONS LTD
Advanced Material Research, 2011, [Reviewed]

Development of CMG Wheels for Stress Relief in Si Wafer Thinning Process
Yuki Mikami; Libo Zhou; Jun Shimizu; Hirotaka Ojima; Yoshiaki Tashiro; Sumio Kamiya, In recent semiconductor industry, production of ever flatter, thinner and larger Si wafer are required to fulfill the demands in high integration and cost reduction. A severe problem encountered in wafer thinning process is the warp and distortion of wafer induced by the residual stress and subsurface damage. Chemo-mechanical grinding (CMG) process is emerging process which combines the advantages of fixed abrasive machining and chemical mechanical polishing (CMP), offers a potential alternative for stress relief. This paper studies the influence of the wheel manufacturing process on the wheel physical properties. Three-factor two-level full factorial designs of experiment are employed to reveal the main effects and interacted effects of mixing method and filtration of raw materials on the bending strength and elastic modulus of CMG wheel. The difference in wheel properties is discussed by association with CMG performance including wheel wear, grinding force and surface roughness., TRANS TECH PUBLICATIONS LTD
Advanced Materials Research, 2011, [Reviewed]

Design of digital filters for Si wafer surface profile measurement - Denoising by total variation -　　　　　　　　　　　　　　　
Hirotaka OJIMA; Kazutaka NONOMURA; Libo Zhou; Jun SHIMIZU; Teppei ONUKI
Proceedings of ASPEN2011, 2011, [Reviewed]

Development of novel polishing system by use of acoustic trap
Tomohiro INADA; Hirotaka Ojima; Libo Zhou; Teppei ONUKI; Jun SHIMIZU, Based on the acoustic levitation phenomenon, we have proposed and developed an acoustic levitation/trap system to control the movements of free abrasives for the finishing of inner surfaces. Described in this paper are the theoretical analysis of levitation force generated in a standing wave field, and experimental results of levitation and trap. A simulation is first performed to determine the wave amplitude and frequency required to levitate the actual abrasives. Based on those results, we developed a system which consists of a sound transducer (speaker), a reflector (an aluminium plate), an amplifier and a function generator, and successfully not only levitated but also trapped actual abrasives in a cylindrical tube. It is found that the relation between the size, density of the abrasives and the power of the acoustic field (wave amplitude and frequency) fairly agreed with the theoretical prediction. Also, the kinetics of levitated abrasives including their positions and movements are precisely controllable by varying the wave frequency and switching from one node position to another., TRANS TECH PUBLICATIONS LTD
Proceedings of ASPEN2011, 2011

Influence of Surface Micro Texture on Photocatalitic Function of Titanium Dioxide Film
Jun Shimizu; Go Kobayashi; Naomi Hasegawa; Takeyuki Yamamoto; Hirotaka Ojima; Teppei Onuki; Libo Zhou, This study aims to develop a high-functional photocatalytic film, of which surface is regularly textured by the micro machining technique in order to earn the real surface area. In this work, a regularly textured TiO2 film surface was fabricated by anodic oxidizing a pure titanium plate with regularly arrayed micro cutting grooves, and its wettabilty was evaluated. Micro cutting grooves were machined by a 3-axis NC control precision machine tool with a single point diamond cutter. Anodic oxidation experiments were conducted by using the self-developed equipment with diluted acetic acid as the electrolyte. As a result, it was found that the wettability of the TiO2 film surface regularly textured by synchronized 3-axial micro cutting was superior to those of the mirror finished or irregularly textured surfaces under the irradiation environment by the ultraviolet rays., TRANS TECH PUBLICATIONS LTD
Materials Science Forum, 2011, [Reviewed]

Mold Fabricated by Nanoscratching for Nanoimprint Lithography
Wataru Ohsone; Jun Shimizu; Libo Zhou; Hirotaka Ojima; Teppei Onuki; Takeyuki Yamamoto; Han Huang, The MEMS technology for various nano/micro devices often requires special facilities and complicated and multistage processes, thus the fabrication cost is extremely high. This research aimed to fabricate nanoscale basic structures on silicon substrates using nanoscratching, which can be potentially used to make nano/micro molds for nanoimprint lithography. In this study, various nano/micro-scale structures, such as groove and, single and multiple layer structures were generated on the silicon substrate using an atomic force microscope equipped with a sharp probe made of monocrystalline diamond. The nanoimprint experiment was also performed using the fabricated single-step mold and silicon-resin to fabricate single island structures., TRANS TECH PUBLICATIONS LTD
Advanced Materials Research, 2010, [Reviewed]

Improvement in oxide-pattern sizes controllability on scanning probe nanolithography
Teppei Onuki; Takashi Tokizaki; Ojima Hirotaka; Jun Shimizu; Libo Zhou, Pattern size controllability of SPM-based nano-lithography especially in vertical direction was improved using in-situ height and depth measurements at the processed point. The transient oxide growth was monitored by light transmission (depth of the oxide, in sample metal surface) and topographical signals measurements obtained from a scanning near-field optical microscope. First, we investigated oxidizing rate limitation on titanium film. At the voltage rise faster than 10 V/sec, the depth growth didn't follow the voltage change in spite of immediate upheaval growth. This result suggested the rate determining of reactive chemicals transport in the titanium oxide. Next, we discovered improvement in the process stability on intractable materials (e.g. iron group elements or noble metals; manganese in this paper) by using thin cap layer of titanium. As the result, the oxidization reaction progressed moderately due to the facts that the oxide of the cap layer is electrical insulative and restriction of the permeability of the reactive chemicals (ingredients of the oxide) that were electrochemically generated at apex of the probe tip., TRANS TECH PUBLICATIONS LTD
Advanced Materials Research, 2010, [Reviewed]

Design of digital filters for Si wafer surface profile measurement – Noise reduction by lifting scheme wavelet transform –
Kazutaka Nonomura; Masashi Ono; Libo Zhou; Jun Shimizu; Hirotaka Ojima, Recently in semiconductor industry, production of ever flatter, thinner and larger silicon wafers are required to fulfill the demands of high-density packaging and cost reduction. In geometric evaluation of Si wafers, according to SEMI (Semiconductor Equipment and Materials International) standards, the required wafer flatness approaches to the 22 nanometers by year 2016 [1]. For such application, uncertainty of measured data is encountered as a severe problem because the requirement has met the limit of available instrument in terms of resolution and reliability. In order to precisely evaluate the wafer profile, it is essential to remove the noise from the measured data. Described in this paper is design and development of digital filters for denoising. In previous paper, digital filters for denoising with Haar wavelet transform are described. In this paper, the new filters by use of 2(nd) generation wavelet transform (lifting scheme) are proposed and show better performance of decomposition in the spatial frequency domain and amplitude domain., TRANS TECH PUBLICATIONS LTD
Advanced Materials Research, 2010, [Reviewed]

ステレオ視法によるSEM画像の3次元形状計測および復元　　　　　　　　　　　　　　　
尾嶌裕隆; 村上幸博; 大塚春樹; 笹本侑弥; 周 立波; 清水 淳; 江田 弘
精密工学会誌, Jun. 2009, [Reviewed]

Study on Path Control Scheme by Laplacian Potential Field and Configuration Space for Vision Guided Micro anipulation System
Hirotaka Ojima; Yoshitaka Yanai; Libo Zhou; Jun Shimizu, In current bio-engineering, most cell manipulations are manually done by skilled operators. The operations are tedious and time consuming, yet with very low yield rate. The cell manipulation is highly expected to be automated. In this research, we have developed an automated micro-manipulation system, in which a vision control scheme has been proposed and implemented for feedback control of the tool position and tool path. In this paper, a path control scheme using potential approach with configuration space and Laplacian potential field is newly proposed to automatically generate the tool path for moving. The performance of the new control scheme is demonstrated with simulation., TRANS TECH PUBLICATIONS LTD
Advances in Abrasive Technology XII, 2009, [Reviewed]

Study on a Micro Lathe with Visual Feedback Control
Hirotaka OJIMA; Libo ZHOU; Jun SHIMIZU; Hiroshi EDA, Micromeso Mechanical Manufacturing (M4) technology has recently attracted attentions as an alternative micromachining solution because of its potentials of processing a wide range of materials into three-dimensional forms. In this research, using a microlathe, which is installable and operational in a Scanning Electron Microscope (SEM), we control the positions and movements of the cutting tool directly with visual feedback scheme from CCD camera. Unlike the conventional feedback control which positions the X-Y table only, this scheme offers a direct control of the position, path and speed to the tool tip. We compare the tool paths with/without visual feedback control, and found the error of the path with visual feedback control is within ±5 pixels (30 μ m). Cutting test is performed to confirm the effect of the visual feedback control scheme and an average of difference between the resultant shape and the ideal profile is less than 10 m. © 2009, Inderscience Publishers.
International Journal of Abrasive Technology, 2009, [Reviewed]

画像情報を用いたダイヤモンドバイト自動研磨システムの開発　　　　　　　　　　　　　　　
仇 中軍; 周 立波; 尾嶌裕隆; 江田 弘; 今井 亨; 山田昌隆
砥粒加工学会誌, May 2007, [Reviewed]

顕微鏡観察視野外を含む接触圧と接触点維持制御機能を有する半導体デバイス評価用プロービングシステムの開発　　　　　　　　　　　　　　　
石川友彦; 江田 弘; 周 立波; 清水 淳; 尾嶌裕隆; 山本佳男; 川上辰男
砥粒加工学会誌, Jun. 2006, [Reviewed]

Wave-based analysis and Impedance Matching for Ladder Networks　　　　　　　　　　　　　　　
Kenji Nagase; Hirotaka Ojima; Yoshikazu Hayakawa
Trans. of the Society of Instrume t and Control Engineers, Nov. 2005

Development of a Vision Guided Micro Lathe　　　　　　　　　　　　　　　
Katsuhiro SAITO; Hirotaka OJIMA; Libo ZHOU; Jun SHIMIZU; Hiroshi EDA
Proceedings of the Int. Conf. on Leading Edge Manufacturing in 21st Century (LEM21), 22 Oct. 2005, [Reviewed]

Development of Visually Guided Micro Lathes　　　　　　　　　　　　　　　
Katsuhiro Saito; Hirotaka Ojima; Libo Zhou; Hiroshi Eda
Proceedings of the 1st Int. Student Conf. at Ibaraki Univ., 14 Jul. 2005, [Reviewed]

On the Analysis of the Impedance Matching Controller for Uniformly Varying Damped Mass-Spring Systems
Hirotaka Ojima; Kenji Nagase; Yoshikazu Hayakawa, 計測自動制御学会
Trans. of the Society of Instrument and Control Engineers, Mar. 2004

Realization of Wave Control for Uniformly Varying Damped Mass-Spring Systems by Active Mass Dampers
Kenji Nagase; Hirotaka Ojima; Yoshikazu Hayakawa, This study considers realization of the wave control for the uniformly varying damped mass-spring systems controlled by the active mass dampers (AMD). We first derive a necessary and sufficient condition for the exact impedance matching to ensure the internal stability. Since the condition is very restrictive and we also need to prevent the drift of the AMD in practice, we next consider the relaxed impedance matching condition and propose a control design method to realize the relaxed impedance matching and to prevent the drift of the AMD. As a design example of the proposed method, the wave control for the multi-story structure is also presented. Efficiency of the controller is examined numerically and experimentally., The Society of Instrument and Control Engineers
Trnas. of the Society of Instrument and Control Engineers, Oct. 2003

A Study on the Impedance Matching Controller for Uniformly Varying Damped Mass-Spring Systems
Hirotaka Ojima; Kenji Nagase; Yoshikazu Hayakawa, This paper considers the analysis of the impedance matching controller for the uniformly varying damped mass-spring systems. The positive real property of the impedance matching controller is first investigated. The closed loop properties of the damped mass-spring systems controlled by the impedance matching controller is also discussed., IEEE
Proceedings of the 2003 American Control Conference, 2003

Wave-based Analysis and Wave Control of Damped Mass-Spring Systems -Characterization from the Propagation Constants-
Hirotaka Ojima; Kenji Nagase; Yoshikazu Hayakawa, This paper concerns with active vibration control of non-uniform damped mass-spring systems by the wave control. Especially, this study considers clarifying a class of a damped mass-spring system that can be analyzed by the wave-based analysis. Because the wave properties are determined by the propagation constants, three conditions for the propagation constants are considered. Necessary and sufficient condition for the physical parameters to hold the three conditions is obtained. Moreover, for this class of damped mass-spring systems, properties of the propagation constants and the characteristic impedances, which achieve the impedance matching, are studied. Numerical examples are shown to prove efficiency of the impedance matching controller., The Society of Instrument and Control Engineers
Trans. of the Society of Instrument and Control Engineers, Mar. 2002

WAVE CONTROL OF MULTI-STORY STRUCTURES BY ACTIVE MASS DAMPERS　　　　　　　　　　　　　　　
Kenji Nagase; Hirotaka Ojima; Yoshikazu Hayakawa
The 6th International Conference on Motion and Vibaration Control Proceedings, 2002

WAVE-BASED ANALYSIS OF DAMPED MASS-SPRING SYSTEMS AND ITS APPLICATION TO WAVE CONTROL OF MULTI-STORY STRUCTURES BY AMD　　　　　　　　　　　　　　　
Kenji Nagase; Hirotaka Ojima; Yoshikazu Hayakawa
Proceedings of International Symposium for Young Researchers on Modeling and their Applications, 2002

Wave-based Analysis and Wave Control of Damped Mass-Spring Systems
Hirotaka Ojima; Kenji Nagase; Yoshikazu Hayakawa, This paper concerns with active vibration control of non-uniform damped mass-spring systems by the wave control. Especially, this study considers clarifying a class of a damped mass-spring system that can be analyzed by the wave-based analysis. Because the wave properties are determined by the propagation constants, three conditions for the propagation constants are considered. Necessary and sufficient condition for the physical parameters to hold the three conditions is obtained. Moreover, for this class of damped mass-spring systems, properties of the propagation constants and the characteristic impedances, which achieve the impedance matching, are studied. Numerical examples are shown to prove efficiency of the impedance matching controller.
40th IEEE CONFERENCE ON DECISION AND CONTROL Conference Proceedings, 2001

Vibration Control of a Class of Damped Mass-Spring Systems Based on Wave-based Analysis　　　　　　　　　　　　　　　
Hirotaka Ojima; Kenji Nagase; Yoshikazu Hayakawa
Proceedings of the SICE/ICASE Workshop -Control Theory and Applications- 2001 Nagoya, Japan, 2001

Wave-based Analysis and Wave Control of Damped Mass-Spring Systems　　　　　　　　　　　　　　　
Hirotaka Ojima; Kenji Nagase; Yoshikazu Hayakawa
40th IEEE CONFERENCE ON DECISION AND CONTROL Conference Proceedings, 2001

Control of the incubation effects in pulsed laser micro machining on ferroelectric lithium niobate substrates　　　　　　　　　　　　　　　
Teppei ONUKI; Ippei MURAYAMA; Takeyuki YAMAMOTO; Hirotaka OJIMA; Jun SHIMIZU; Libo ZHOU
Procedings of 7th LEM21, Nov. 2013, [Reviewed]

Three-dimensional cutting edge distribution of abrasives on diamond grinding wheel working surface　　　　　　　　　　　　　　　
Libo ZHOU; Yutaro EBINA; Jun SHIMIZU; Teppei ONUKI; Hirotaka OJIMA; Takeyuki YAMAMOTO
Proceedings of 7th LEM21, Nov. 2013, [Reviewed]

Surface Texturing by Making Use of Microploughing　　　　　　　　　　　　　　　
Jun Shimizu; Takeyuki Yamamoto; Libo Zhou; Teppei Onuki; Hirotaka Ojima
Proceedings of 5th WTC 2013, 2013, [Reviewed]

Micro laser ablation using 1064nm-wavelength pico-second pulsed laser on monocrystalline lithium niobate surface　　　　　　　　　　　　　　　
Fumihiro Aizawa; Teppei Onuki; Takeyuki Yamamoto; Hirotaka Ojima; Jun Shimizu; Libo Zhou
Proceedings of The 3rd International Conference on Nanomanufacturing (nanoMan2012), 2012, [Reviewed]

Micro EDM Milling Making Greater Use of Electrode Tip Roundness　　　　　　　　　　　　　　　
Akihiro Ueda; Takeyuki Yamamoto; Jun Shimizu; Libo Zhou; Teppei Onuki; Hirotaka Ojima
Proceedings of The 3rd International Conference on Nanomanufacturing (nanoMan2012), 2012, [Reviewed]

Development of Cutting Tool Accompanied by Local Hydrostatic Pressure Field Formation - Proposal of Cutting Model by Using Molecular Dynamics -　　　　　　　　　　　　　　　
Keito Uezaki; Jun Shimizu; Libo Zhou; Teppei Onuki; Hirotaka Ojima; Takeyuki Yamamoto
Proceedings of the 6th International Conference on Micromanufacturing (ICOMM2011), 2011, [Reviewed]

Short pulse laser micro machining on hard and brittle monocrystal surfaces　　　　　　　　　　　　　　　
Fumihiro Aizawa; Teppei Onuki; Takeyuki Yamamoto; Hirotaka Ojima; Jun Shimizu; Libo Zhou
Proceedings of the 6th International Conference on Micromanufacturing (ICOMM2011), 2011, [Reviewed]

Image based defect detection algorithm by use of wavelet transformation　　　　　　　　　　　　　　　
Kaoru TAKAMORI; Hirotaka OJIMA; Libo ZHOU; Teppei ONUKI; Jun SHIMIZU; Takeyuki YAMAMOTO
Proceedings of 6th LEM21, 2011, [Reviewed]

Nanomold Fabrication by Scratching and Its Application to Nanoimprint Lithography　　　　　　　　　　　　　　　
Jun SHIMIZU; Wataru OHSONE; Hirotaka OJIMA; Teppei ONUKI; Libo ZHOU; Takeyuki YAMAMOTO
Proceedings of 6th LEM21, 2011, [Reviewed]

Enhancement of Photocatalytic Reaction of Titanium Dioxide Film by Surface Texturing
Jun Shimizu; Libo Zhou; Kaoru Takamori; Hirotaka Ojima; Takeyuki Yamamoto; Han Huang
Materials Science Forum, 2010

Development of Electrodes with Micro Ploughing Patterns for MEMS Applications　　　　　　　　　　　　　　　
Jun Shimizu; Naoki Suzuki; Libo Zhou; Teppei Onuki; Hirotaka Ojima; Takeyuki Yamamoto; Han Huang
Proceedings of International Tribology Congress – ASIATRIB 2010, 2010, [Reviewed]

Molecular Dynamics Simulation of Influence of Two-dimensional Stick-slip Phenomenon on Atomic-scale Friction Anisotropy　　　　　　　　　　　　　　　
Jun Shimizu; Libo Zhou; Hirotaka Ojima; Takeyuki Yamamoto
Proceedings of Asian Symposium for Precision Engineering and Nanotechnology 2009 (ASPEN2009), 2009, [Reviewed]

Research on 3D data Acquisition and Configuration of Live Images　　　　　　　　　　　　　　　
Yuya Sasamoto; Hirotaka Ojima; Libo Zhou; Jun Shimizu
Proc. of the 5th International Conference on Leading Edge Manufacturing in 21st Century (LEM21), 2009, [Reviewed]

Study on Path Control Scheme by Potential Method for Vision Guided Micro Manipulation System　　　　　　　　　　　　　　　
Hirotaka Ojima; Hiroyuki Asano; Genki Shimizu; Libo Zhou; Jun Shimizu; Hiroshi Eda
Proc. of the 5th International Conference on Leading Edge Manufacturing in 21st Century (LEM21), 2009, [Reviewed]

Research on Enhancement of Photocatalystic Activities of Titanium Dioxide Film Surface by Generating Microcutting Grooves　　　　　　　　　　　　　　　
Jun Shimizu; Libo Zhou; Kaoru Takamori; Hirotaka Ojima; Takeyuki Yamamoto
Proc. of the 5th International Conference on Leading Edge Manufacturing in 21st Century (LEM21), 2009, [Reviewed]

Study on Path Control Scheme for Vision Guided Micro Manipulation System
Hirotaka Ojima; Hiroyuki Asano; Genki Shimizu; Libo Zhou; Jun Shimizu; Hiroshi Eda
Proceedings of the 4th International Conference on Leading Edge Manufacturing in 21st Century (LEM21), 07 Nov. 2007, [Reviewed]

3D Data Acquisition and Configuration by Means of Binocular Stereopsis
Haruki Otsuka; Yukihiro Murakami; Zhoungjun. Qiu; Hirotaka Ojima; Libo Zhou; Jun Shimizu; Hiroshi Eda
Proceedings of the 35th International MATADOR Conference, 18 Jul. 2007, [Reviewed]

Visual Feedback Control of a Micro Lathe
Hiroraka OJIMA; Katsuhiro SAITO; Libo ZHOU; Jun SHIMIZU; Hiroshi EDA
Towards Synthesis of Micro-/Nano-systems (The 11th International Conference on Precision Engineering (ICPE)), 16 Aug. 2006, [Reviewed]

Path Control Scheme for Vision Guided Micro Manipulation System
Hiroyuki Asano; Zhougjun Qiu; Libo Zhou; Hirotaka Ojima; Jun Shimizu; Tomohiko Ishikawa; Hiroshi Eda:
Towards Synthesis of Micro-/Nano-systems (The 11th International Conference on Precision Engineering (ICPE)), 16 Aug. 2006, [Reviewed]

未来型アクチュエータ材料・デバイス 第9章第7節「超磁歪アクチュエータ」　　　　　　　　　　　　　　　
江田 弘; 尾嶌裕隆, Joint work
シーエムシー出版, Dec. 2006
4882315866

機械学習による波紋画像の周波数識別モデルの開発　　　　　　　　　　　　　　　
尾嶌裕隆; 堀 優世; 周 立波; 清水 淳; 小貫哲平; 金子和暉; 髙倉伸二; 泉 栄人; 泉 富栄
2023年度精密工学会春季大会, 14 Mar. 2023, 精密工学会
20230314, 20230316

深層学習による切削加工音を用いた異常検知システムの開発　　　　　　　　　　　　　　　
石川翔梧; 小松敏大; 村越智弘; 周 立波; 清水 淳; 小貫哲平; 尾嶌裕隆; 金子和暉
2023年度精密工学会春季大会, 14 Mar. 2023, 精密工学会
20230314, 20230316

AI技術を用いた切削工具摩耗の異常検知　　　　　　　　　　　　　　　
村越智弘; 周 立波; 小貫哲平; 尾嶌裕隆; 清水 淳; 金子和暉
2022年度砥粒加工学会(ABTEC), 31 Aug. 2022, 砥粒加工学会
20220829, 20220831

砥石表面3次元計測による砥粒判別　　　　　　　　　　　　　　　
大野光貴; 尾嶌裕隆; 周 立波; 小貫哲平; 清水 淳; 金子和暉
2022年度砥粒加工学会(ABTEC), 30 Aug. 2022, 砥粒加工学会
20220829, 20220831

複数ラベルを用いた機械学習による画像認識の研究　　　　　　　　　　　　　　　
澤田篤彦; 尾嶌裕隆; 周 立波; 清水 淳; 小貫哲平; 金子和暉
精密工学会 第29回「学生会員卒業研究発表講演会」, Mar. 2022, 精密工学会
20220315, 20220315

深層学習を用いた砥粒判別に関する研究　　　　　　　　　　　　　　　
尾嶌裕隆; 西村賢宏; 澤田篤彦; 周 立波; 小貫哲平; 清水 淳
ABTEC2021, Sep. 2021, 砥粒加工学会
20210901, 20210903

ハイブリッド送り機構を用いたCFRP研削加工機の開発　　　　　　　　　　　　　　　
Hirotaka OJIMA; Daisuke TAKENOUCHI; Kouta AOYAGI; Libo ZHOU; Jun SHIMIZU; Teppei ONUKI
2017年度精密工学会秋季大会学術講演会, 20 Sep. 2017, 精密工学会

ステレオ画像による砥石作業面トポグラフィの機上 3 次元計測システムの高精度化　　　　　　　　　　　　　　　
Kazuki KOMATSUZAKI; Yuya SOUDA; Hirotaka OJIMA; Teppei ONUKI; Jun SHIMIZU; Libo ZHOU
2017年度茨城講演会, 29 Aug. 2017, 日本機械学会

Research on On-Machine 3D Measuring System of Grinding Wheel Surface Topography by Binocular Stereopsis　　　　　　　　　　　　　　　
Hirotaka OJIMA; Kazuki KOMATSUZAKI; Libo ZHOU; Jun SHIMIZU; Teppei ONUKI
2016年度精密工学会秋季大会学術講演会, 06 Sep. 2016, 精密工学会

Study on new algorithm of total variation for digital filter denoising　　　　　　　　　　　　　　　
Hirotaka OJIMA; Libo ZHOU; Jun SHIMIZU; Teppei ONUKI
2016年度精密工学会春季大会学術講演会, 15 Mar. 2016, 精密工学会

Development of CFRP processing machine – Stage control with hybrid feeding mechanism –　　　　　　　　　　　　　　　
Hirotaka OJIMA; Kazuki AITA; Gao Yicong; Libo ZHOU; Jun SHIMIZU; Teppei ONUKI
2015年度精密工学会秋季大会学術講演会, 04 Sep. 2015, 精密工学会

Research on Development of On-Machine 3D Measuring System of Grinding Wheel Surface Topography by Binocular Stereopsis　　　　　　　　　　　　　　　
Hirotaka OJIMA; Takuya NAGAYAMA; Libo ZHOU; Jun SHIMIZU; Teppei ONUKI
2015年度精密工学会春季大会学術講演会, 19 Mar. 2015, 精密工学会

Research on Development of On-Machine 3D Measuring System of Grinding Wheel Surface Topography by Binocular Stereopsis　　　　　　　　　　　　　　　
Hirotaka OJIMA; Takuya NAGAYAMA; Libo ZHOU; Jun SHIMIZU; Teppei ONUKI
2014年度精密工学会秋季大会学術講演会, 16 Sep. 2014, 精密工学会

２次元ディジタルフィルタを用いた面領域ウェーブレット変換の開発　　　　　　　　　　　　　　　
尾嶌裕隆; 鈴木泰樹; 周 立波; 清水 淳; 小貫哲平
2014年度精密工学会春季大会学術講演会, 18 Mar. 2014, 精密工学会(JSPE)

Research on Development of On-Machine 3D Measuring System of Grinding Wheel Surface Topography by Stereo Images　　　　　　　　　　　　　　　
Takuya NAGAYAMA; Hirotaka OJIMA; Teppei ONUKI; Jun SHIMIZU; Libo ZHOU
2014精密工学会春季大会学術講演会, 18 Mar. 2014, 精密工学会

面領域ウェーブレット変換と２次元ディジタルフィルタの開発に関する研究　　　　　　　　　　　　　　　
尾嶌裕隆; 鈴木泰樹; 周 立波; 清水 淳; 小貫哲平
2013年度精密工学会秋季大会学術講演会, 14 Sep. 2013, 精密工学会(JSPE)

音響浮揚の保持能力向上に関する研究　　　　　　　　　　　　　　　
稲田智広; 周 立波; 尾嶌裕隆; 小貫哲平
第21回茨城講演会, 06 Sep. 2013, 日本機械学会(JSME)関東支部

2次元画像に適応するための面領域ウェーブレット変換の開発　　　　　　　　　　　　　　　
鈴木泰樹; 尾嶌裕隆; 周 立波; 清水 淳; 小貫哲平
第14回高エネ研メカ・ワークショップ, 12 Apr. 2013, 高エネルギー加速器研究機構(KEK)

Study on Development of On-Machine 3D Measuring System of Grinding Wheel Surface Topography by Binocular Stereopsis　　　　　　　　　　　　　　　
Hidetaka NOGUCHI; Takuya NAGAYAMA; Hirotaka OJIMA; Teppei ONUKI; Jun SHIMIZU; Libo ZHOU
2013年度精密工学会春季大会学術講演会, 14 Mar. 2013, 精密工学会

Development of Areal Wavelet Transform applying to the 2D image　　　　　　　　　　　　　　　
Taiju SUZUKI; Hirotaka OJIMA; Libo ZHOU; Jun SHIMIZU; Teppei ONUKI
International Symposium on Ultraprecision Engineering and Nanotechnology（ISUPEN）, 13 Mar. 2013, 精密工学会

Research on defect detection method by image processing using wavelet transform　　　　　　　　　　　　　　　
Hirotaka OJIMA; Taiju SUZUKI; Daisuke TOMITA; Libo ZHOU; Jun SHIMIZU; Teppei ONUKI
第9回生産加工・工作機械部門講演会, 27 Oct. 2012, 機械工学会 生産加工・工作機械部門

3D measurement of abrasive grain shape and its distribution in the grinding wheel by binocular stereopsis　　　　　　　　　　　　　　　
野口秀崇; 尾嶌裕隆; 小貫哲平; 清水 淳; 周 立波
第20回茨城講演会, 24 Aug. 2012, 日本機会学会関東支部

Siウエハの計測評価技術におけるノイズフィルタに関する研究―Total variationを用いたフィルタ設計―　　　　　　　　　　　　　　　
尾嶌裕隆; 野々村和隆; 周 立波; 清水 淳; 小貫哲平
2012年度精密工学会春季大会学術講演会, 16 Mar. 2012, 精密工学会

音響浮揚を用いた砥粒加工方式の開発に関する研究　　　　　　　　　　　　　　　
尾嶌裕隆; 稲田智広; 周 立波; 小貫哲平; 清水 淳
2011年度精密工学会秋季大会学術講演会, 20 Sep. 2011, 精密工学会

Wavelet変換による大口径Si ウェハの計測評価技術に関する研究　　　　　　　　　　　　　　　
尾嶌裕隆; 野々村和隆; 高森 郁; 周 立波; 清水 淳; 小貫哲平
2011年度砥粒加工学会学術講演会（ABTEC2011）, 08 Sep. 2011, 砥粒加工学会

Wavelet変換を用いた画像処理によるキズ検査に関する研究　　　　　　　　　　　　　　　
高森 郁; 小野真志; 野々村和隆; 周 立波; 尾嶌裕隆
2010年度精密工学会秋季大会学術講演会, 27 Sep. 2010, 精密工学会

細胞操作用マイクロマニピュレータの経路生成および制御　　　　　　　　　　　　　　　
尾嶌裕隆; 箭内善宇; 周 立波; 清水 淳
2009年度精密工学会春季大会学術講演会, 11 Mar. 2009, 精密工学会

ラプラスポテンシャルを用いたマイクロマニピュレータの軌道生成に関する研究　　　　　　　　　　　　　　　
箭内善宇; 尾嶌裕隆; 周 立波; 清水 淳
日本機械学会関東学生会 第48回学生員卒業研究発表講演会, 06 Mar. 2009, 日本機械学会

ステレオ法による3次元計測に関する研究　　　　　　　　　　　　　　　
笹本侑弥; 松原健太; 周 立波; 尾嶌裕隆; 清水 淳
2008年度精密工学会秋季大会学術講演会, 19 Sep. 2008, 精密工学会

細胞操作用マイクロマニピュレータの経路生成に関する研究　　　　　　　　　　　　　　　
尾嶌裕隆; 箭内善宇; 周 立波; 清水 淳
2008年度精密工学会秋季大会学術講演会, 18 Sep. 2008, 精密工学会

ステレオ法による三次元形状計測に関する研究-特徴点抽出手法の検討-　　　　　　　　　　　　　　　
松原謙太; 笹本侑弥; 周 立波; 尾嶌裕隆; 清水 淳
2008年度日本機械学会関東支部・精密工学会共催茨城講演会, 12 Sep. 2008, 日本機械学会関東支部・精密工学会 共催

ステレオ法による三次元計測および形状データ構築　　　　　　　　　　　　　　　
大塚春樹; 笹本侑弥; 尾嶌裕隆; 周 立波; 清水 淳; 江田 弘
2008年度精密工学会春季大会学術講演会, 19 Mar. 2008, 精密工学会

細胞操作用マイクロマニピュレータの最適経路生成に関する研究　　　　　　　　　　　　　　　
尾嶌裕隆; 土屋大基; 周 立波; 清水 淳; 江田 弘
2008年度精密工学会春季大会学術講演会, 19 Mar. 2008, 精密工学会

ステレオ法によるSEM画像からの3次元計測および形状復元　　　　　　　　　　　　　　　
笹本侑弥; 大塚春樹; 周 立波; 尾嶌裕隆; 清水 淳; 江田 弘
2007年度日本機械学会関東支部・精密工学会共催茨城講演会, 28 Sep. 2007, 日本機械学会関東支部・精密工学会共催

真空中でのマイクロ加工機による精密加工の研究　　　　　　　　　　　　　　　
尾嶌裕隆; 吉原庸介; 周 立波; 清水 淳; 江田 弘
2007年度精密工学会春季大会学術講演会講演論文集, 20 Mar. 2007

ステレオ法によるSEM画像からの3次元微細形状計測　　　　　　　　　　　　　　　
村上幸博; 大塚春樹; 仇 中軍; 周 立波; 尾嶌裕隆; 清水 淳; 江田 弘
2007年度精密工学会春季大会 14回学生会員卒業研究発表講演会講演論文集, 20 Mar. 2007

超磁歪素子を用いた振動子に関する研究　　　　　　　　　　　　　　　
楠原隆之; 三宅佑治; 尾嶌裕隆; 周 立波; 清水 淳; 江田 弘
日本機械学会第6回生産加工・工作機械部門講演会講演論文集, 24 Nov. 2006

光学ガラスの超精密CMG加工に関する研究　　　　　　　　　　　　　　　
仇 中軍; 椎名剛志; 周 立波; 尾嶌裕隆; 江田 弘
日本機械学会第6回生産加工・工作機械部門講演会講演論文集, 24 Nov. 2006

画像情報援用マイクロ加工機の開発　　　　　　　　　　　　　　　
尾嶌裕隆; 吉原庸介; 周 立波; 清水 淳; 江田 弘
2006年度精密工学会秋季大会学術講演会講演論文集, 22 Sep. 2006

真空中におけるマイクロ・ナノ加工機構に関する研究　　　　　　　　　　　　　　　
藤森健太; 吉原庸介; 尾嶌裕隆; 周 立波; 江田 弘
2006年度日本機械学会関東支部・精密工学会共催茨城講演会, 15 Sep. 2006, 日本機械学会関東支部・精密工学会共催

マイクロマニピュレーションの軌道制御に関する研究　　　　　　　　　　　　　　　
清水元喜; 浅野裕之; 周 立波; 尾嶌裕隆; 仇 中軍; 石川友彦; 江田 弘
2006年度日本機械学会関東支部・精密工学会共催茨城講演会, 15 Sep. 2006, 日本機械学会関東支部・精密工学会共催

画像情報を用いたダイヤモンドバイト自動研磨システムの開発　　　　　　　　　　　　　　　
仇 中軍; 周 立波; 尾嶌裕隆; 江田 弘; 山田昌隆; 松本健一
日本機械学会2006年度年次大会講演論文集, 19 Aug. 2006

画像情報援用マイクロ加工機の位置制御に関する研究　　　　　　　　　　　　　　　
尾嶌裕隆; 齊藤勝弘; 周 立波; 清水 淳; 江田 弘
日本機械学会関東支部第12期総会講演会講演論文集, 11 Mar. 2006

ダイヤモンドバイト自動研磨システムの開発〜ライブ画像を用いた切れ刃形状の検出及び創成制御〜　　　　　　　　　　　　　　　
大塚春樹; 仇 中軍; 周 立波; 尾嶌裕隆; 江田 弘
関東学生会第45回学生員卒業研究発表講演前刷集, 10 Mar. 2006

On-Machine 3D形状計測システムの開発　　　　　　　　　　　　　　　
バーマン ソルタニ ホセイニ; 周 立波; 清水 淳; 尾嶌裕隆; 江田 弘
関東学生会第45回学生員卒業研究発表講演前刷集, 10 Mar. 2006

Development of a Micro Lathe with Visual Feedback　　　　　　　　　　　　　　　
尾嶌裕隆; 齊藤勝弘; 周立波; 清水淳; 江田弘
2005年度精密工学会秋季大会 学術講演解講演論文集, Sep. 2005

画像フィードバックによるマイクロ加工機械の位置決め制御に関する研究　　　　　　　　　　　　　　　
尾嶌裕隆; 齊藤勝弘; 周 立波; 清水 淳; 江田 弘; 碓井雄一
2005年度精密工学会春季大会学術講演会講演論文集, 18 Mar. 2005

画像フィードバックによる位置決めに関する研究　　　　　　　　　　　　　　　
尾嶌裕隆; 齊藤勝弘; 周 立波; 清水 淳; 江田 弘
日本機械学会第5回生産加工・工作機械部門講演会講演論文集, 21 Nov. 2004

画像フィードバックを用いたマイクロ加工機械の制御　　　　　　　　　　　　　　　
齊藤勝弘; 尾嶌裕隆; 周 立波; 清水 淳; 江田 弘
2004年度精密工学会秋季大会学術講演会講演論文集, 16 Sep. 2004

Oct. 2007, The Japan Society for Abrasive Technology

May 2004, The Japan Society of Precision Engineering

Apr. 1999, The Society of Instrument and Control Engineers

Sep. 1996, The Japan Society of Mechanical Engineers

超解像Raman断層計測を用いた結晶損傷発生機構の解明と先端加工技術への応用
Grant-in-Aid for Scientific Research (B)
Ibaraki University
Apr. 2021 - Mar. 2025

地方三セク鉄道向けDBM(data-based maintenance) 保線支援装置の開発　　　　　　　　　　　　　　　
A-STEPトライアウトタイプ
Oct. 2022 - Mar. 2024

航空機エンジン用高硬度薄肉中空難加工材部品の切削時現場判断のAI化と工作機械の自動化技術の開発　　　　　　　　　　　　　　　
Apr. 2020 - Mar. 2023

Overcoming weaknesses and elucidating tribological phenomena by a new trial of molecular dynamics analysis considering experimental results
Grant-in-Aid for Scientific Research (C)
Ibaraki University
Apr. 2020 - Mar. 2023

液面波形検出法を利用した設備異常検知技術に関する研究　　　　　　　　　　　　　　　
Sep. 2022 - Feb. 2023

Examination of replaceability of scraping with texturing by micro-vibration assisted cutting
Grant-in-Aid for Scientific Research (C)
Ibaraki University
Apr. 2019 - Mar. 2022

Development of CFRP processing machine and drilling process with hydrostatic pressure application jig and hybrid feed mechanism
Grant-in-Aid for Scientific Research (C)
Ibaraki University
Apr. 2016 - Mar. 2019

Development of mechanical + chemical hybrid manufacturing technology of sapphire crystal wafer
Grant-in-Aid for Scientific Research (A)
Ibaraki University
Apr. 2015 - Mar. 2019

Development of a novel high-integrity cutting method by use of localized materials hardening due to tribo-compressive hydrostatic stress
Grant-in-Aid for Scientific Research (C)
Ibaraki University
Apr. 2015 - Mar. 2018